SCHEMBL1906552

SCHEMBL1906552

O=C(O)C(O)=S

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
Ammonia Solution, Strong SCHEMBL10442408 0.95
Thioglycolic Acid SCHEMBL1472977 0.78 FOLH1 (0.35)
SCHEMBL10535990 0.74
Bicarbonate SCHEMBL2954172 0.71
SCHEMBL4783424 0.70
SCHEMBL9792220 0.70
SCHEMBL17075243 0.70
Oxalic Acid SCHEMBL8432824 0.68
Oxalic Acid SCHEMBL11211823 0.68 CA1 (0.57)
Oxalic Acid SCHEMBL776 0.68

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 117 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20250127168-A1 METHOD FOR PATHOGENS, MICROORGANISMS, AND PARASITES INACTIVATION NEW YORK BLOOD CENTER, INC. 2025-04-24 US claimed
US-20250049031-A1 METHOD FOR PATHOGENS, MICROORGANISMS, AND PARASITES INACTIVATION NEW YORK BLOOD CENTER, INC. 2025-02-13 US claimed
CN-107207719-A Linear inorganic coordination polymers, metal complexes, metal nanostructures, and catalyst compositions comprising the same 株式会社LG化学 2017-09-26 CN claimed
US-20100155108-A1 Electroless nickel plating solution composition, flexible printed circuit board and manufacturing method thereof SAMSUNG ELECTRO-MECHANICS CO., LTD. (KR) 2010-06-24 US claimed
EP-0982331-B1 An improved process for the preparation of stable aqueous urethane dispersions COUNCIL SCIENT IND RES (IN) 2005-10-26 EP claimed
EP-0982331-A1 An improved process for the preparation of stable aqueous urethane dispersions Council of Scientific and Industrial Research (IN) 2000-03-01 EP claimed
US-20250127168-A1 METHOD FOR PATHOGENS, MICROORGANISMS, AND PARASITES INACTIVATION NEW YORK BLOOD CENTER, INC. 2025-04-24 US disclosed
US-12259651-B2 Photosensitive, inorganic ligand-capped inorganic nanocrystals THE UNIVERSITY OF CHICAGO (US) 2025-03-25 US disclosed
CN-119552107-A Heteroaromatic amide CYP1B1 enzyme inhibitor, and preparation method and application thereof 沈阳药科大学 2025-03-04 CN disclosed
US-20250049031-A1 METHOD FOR PATHOGENS, MICROORGANISMS, AND PARASITES INACTIVATION NEW YORK BLOOD CENTER, INC. 2025-02-13 US disclosed
US-12187984-B2 Treatment liquid and method for treating object to be treated FUJIFILM CORPORATION (JP) 2025-01-07 US disclosed
US-20240317664-A1 PHENANTHRENE-BASED COMPOUND HAVING HIGH REFRACTIVE INDEX AND PREPARATION METHOD THEREFOR Research & Business Foundation Sungkyunkwan University (KR) 2024-09-26 US disclosed
CN-118308710-A Low-temperature chemical nickel plating solution and nickel plating process suitable for PCB surface treatment 南通星盛亿新材料科技有限公司 2024-07-09 CN disclosed
EP-0303792-A1 A hair reviver composition containing film-forming amino acid salts S.C. JOHNSON & SON, INC. (US) 1989-02-22 EP disclosed
US-4777087-A MIXTURE OF POLYSILOXANE AND COMPLEX OF TRANSITION METAL SALT AND LIGAND XEROX CORPORATION (US) 1988-10-11 US disclosed
EP-0282302-A2 High-speed processing of silver halide photographic light- sensitive materials KONICA CORPORATION (JP) 1988-09-14 EP disclosed
EP-0211065-A4 CORROSION INHIBITOR FOR HIGH DENSITY BRINES. DOW CHEMICAL CO (US) 1988-07-29 EP disclosed
EP-0260072-A2 Purified enzyme and process therefor ELI LILLY AND COMPANY (US) 1988-03-16 EP disclosed
EP-0211065-A1 CORROSION INHIBITOR FOR HIGH DENSITY BRINES. DOW CHEMICAL CO (US) 1987-02-25 EP disclosed
WO-1986004634-A1 CORROSION INHIBITOR FOR HIGH DENSITY BRINES THE DOW CHEMICAL COMPANY (US) 1986-08-14 WO disclosed