SCHEMBL1906994

SCHEMBL1906994

C#CC(C)=CCC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2138036 1.00
SCHEMBL1420471 0.77
SCHEMBL1420506 0.77
SCHEMBL1420407 0.77
SCHEMBL20384995 0.77
SCHEMBL9579415 0.74
SCHEMBL9579411 0.74
SCHEMBL1305239 0.72
SCHEMBL1305241 0.72
SCHEMBL2164380 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 291 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-116478408-B Organosilicon polymer and preparation method thereof, and solvent-free polyorganosiloxane compound 万华化学集团股份有限公司 2025-02-18 CN claimed
CN-118290746-A Organosilicon polymer and preparation method thereof 万华化学集团股份有限公司 2024-07-05 CN claimed
CN-116478408-A Organosilicon polymer and preparation method thereof, and solvent-free polyorganosiloxane compound 万华化学集团股份有限公司 2023-07-25 CN claimed
EP-1004632-B1 Silicone composition for forming cured release films DOW CORNING TORAY SILICONE (JP) 2003-12-10 EP claimed
US-6586535-B1 Polysiloxanes containing alkenyl groups DOW CORNING CORPORATION 2003-07-01 US claimed
US-6489407-B1 SOLVENT-FREE (CO-)POLYSILOXANES USED AS ANTISTICK AGENTS FOR LAMINATION OF PAPER SUBSTRATES DOW CORNING CORPORATION 2002-12-03 US claimed
US-6300426-B1 IMPARTS TO THE SURFACES OF VARIOUS SUBSTRATES, SUCH AS PAPER, SYNTHETIC RESIN FILM, OR METAL FOIL, RELEASE PROPERTIES RELATIVE TO TACKY SUBSTANCES DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) 2001-10-09 US claimed
US-6124419-A A RELEASE MODIFIER COMPRISING AN ALKENYL FUNCTIONAL POLYORGANOSILOXANE AND A BRANCHED OLEFIN USEFUL IN RELEASE PRESSURE SENSITIVE ADHESIVES FROM A VARIETY OF SUBSTRATES DOW CORNING, LIMITED (GB) 2000-09-26 US claimed
EP-1004632-A1 Silicone composition for forming cured release films Dow Corning Toray Silicone Company, Ltd. (JP) 2000-05-31 EP claimed
EP-0980903-A2 Release modifier compositions DOW CORNING CORPORATION (US) 2000-02-23 EP claimed
US-5708046-A ALKENYL SILOXANES, ORGANOHYDROGENSILOXANES, POLYMERIZATION INHIBITORS FOR STORAGE STABILITY DOW CORNING CORPORATION (US) 1998-01-13 US claimed
EP-0764703-A2 Silicone release coating compositions Dow Corning Toray Silicone Company Ltd. (JP) 1997-03-26 EP claimed
US-20260132325-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2026-05-14 US disclosed
CN-122011778-A Gel-type thermal interface material 霍尼韦尔国际公司 2026-05-12 CN disclosed
EP-4716962-A1 HIGHLY THERMALLY CONDUCTIVE HYBRID THERMAL INTERFACE MATERIAL Solstice Advanced Materials US, Inc. (US) 2026-04-01 EP disclosed
EP-4370606-B1 THERMAL CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2026-01-28 EP disclosed
EP-0094185-B1 USE OF PEELABLE FILM-FORMING ORGANOPOLYSILOXANE COMPOSITIONS Toray Silicone Company Limited (JP) 1989-07-05 EP disclosed
EP-0091291-B1 ROOM TEMPERATURE STABLE, HEAT ACTIVATED ORGANOPOLYSILOXANE COMPOSITIONS Toray Silicone Company Limited (JP) 1987-05-13 EP disclosed
EP-0094185-A2 Use of peelable film-forming organopolysiloxane compositions Toray Silicone Company Limited (JP) 1983-11-16 EP disclosed
EP-0091291-A2 Room temperature stable, heat activated organopolysiloxane compositions Toray Silicone Company Limited (JP) 1983-10-12 EP disclosed