SCHEMBL2138036

SCHEMBL2138036

C#C/C(C)=C/CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1906994 1.00
SCHEMBL1420471 0.77
SCHEMBL1420506 0.77
SCHEMBL1420407 0.77
SCHEMBL20384995 0.77
SCHEMBL9579415 0.74
SCHEMBL9579411 0.74
SCHEMBL1305239 0.72
SCHEMBL1305241 0.72
SCHEMBL2164380 0.71

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 240 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-1004632-B1 Silicone composition for forming cured release films DOW CORNING TORAY SILICONE (JP) 2003-12-10 EP claimed
US-6586535-B1 Polysiloxanes containing alkenyl groups DOW CORNING CORPORATION 2003-07-01 US claimed
US-6489407-B1 SOLVENT-FREE (CO-)POLYSILOXANES USED AS ANTISTICK AGENTS FOR LAMINATION OF PAPER SUBSTRATES DOW CORNING CORPORATION 2002-12-03 US claimed
US-6300426-B1 IMPARTS TO THE SURFACES OF VARIOUS SUBSTRATES, SUCH AS PAPER, SYNTHETIC RESIN FILM, OR METAL FOIL, RELEASE PROPERTIES RELATIVE TO TACKY SUBSTANCES DOW CORNING TORAY SILICONE COMPANY, LTD. (JP) 2001-10-09 US claimed
US-6124419-A A RELEASE MODIFIER COMPRISING AN ALKENYL FUNCTIONAL POLYORGANOSILOXANE AND A BRANCHED OLEFIN USEFUL IN RELEASE PRESSURE SENSITIVE ADHESIVES FROM A VARIETY OF SUBSTRATES DOW CORNING, LIMITED (GB) 2000-09-26 US claimed
EP-1004632-A1 Silicone composition for forming cured release films Dow Corning Toray Silicone Company, Ltd. (JP) 2000-05-31 EP claimed
EP-0980903-A2 Release modifier compositions DOW CORNING CORPORATION (US) 2000-02-23 EP claimed
US-5708046-A ALKENYL SILOXANES, ORGANOHYDROGENSILOXANES, POLYMERIZATION INHIBITORS FOR STORAGE STABILITY DOW CORNING CORPORATION (US) 1998-01-13 US claimed
EP-0764703-A2 Silicone release coating compositions Dow Corning Toray Silicone Company Ltd. (JP) 1997-03-26 EP claimed
US-20260132325-A1 THERMALLY CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2026-05-14 US disclosed
CN-122011778-A Gel-type thermal interface material 霍尼韦尔国际公司 2026-05-12 CN disclosed
EP-4370606-B1 THERMAL CONDUCTIVE SILICONE COMPOSITION DOW SILICONES CORP (US) 2026-01-28 EP disclosed
EP-4240433-B1 MEDICAL SILICONE PRESSURE-SENSITIVE ADHESIVE COMPOSITION ELKEM SILICONES SHANGHAI CO LTD (CN) 2025-12-24 EP disclosed
US-12503599-B2 Thermal conductive silicone composition DOW SILICONES CORPORATION (US) 2025-12-23 US disclosed
US-5789485-A Curable silicone compositions DOW CORNING TORAY SILICONE CO., LTD. (JP) 1998-08-04 US disclosed
EP-0822231-A2 Silicone rubber composition having flame-retardant and electrical insulating properties Dow Corning Toray Silicone Company, Limited (JP) 1998-02-04 EP disclosed
EP-0781811-A2 Curable silicone compositions Dow Corning Toray Silicone Co., Ltd. (JP) 1997-07-02 EP disclosed
EP-0094185-B1 USE OF PEELABLE FILM-FORMING ORGANOPOLYSILOXANE COMPOSITIONS Toray Silicone Company Limited (JP) 1989-07-05 EP disclosed
EP-0091291-B1 ROOM TEMPERATURE STABLE, HEAT ACTIVATED ORGANOPOLYSILOXANE COMPOSITIONS Toray Silicone Company Limited (JP) 1987-05-13 EP disclosed
EP-0094185-A2 Use of peelable film-forming organopolysiloxane compositions Toray Silicone Company Limited (JP) 1983-11-16 EP disclosed