SCHEMBL191028

SCHEMBL191028

CC[Si](CCCN=C=O)(OC)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL395746 0.94
SCHEMBL395750 0.93 NAAA (0.31)
SCHEMBL391188 0.93 NAAA (0.31)
SCHEMBL4613301 0.90
SCHEMBL391193 0.88
SCHEMBL19125242 0.87 NAAA (0.31)
SCHEMBL16892663 0.83
SCHEMBL191068 0.83
SCHEMBL1998069 0.81
SCHEMBL16239314 0.80

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 353 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-4619451-A1 MODIFIED POLYMER POLYOLS Repsol, S.A. (ES) 2025-09-24 EP claimed
WO-2024105080-A1 MODIFIED POLYMER POLYOLS REPSOL, S.A. (ES) 2024-05-23 WO claimed
US-20210189053-A1 STABLE MODIFIED POLYMER POLYOL DISPERSIONS REPSOL, S.A. (ES) 2021-06-24 US claimed
EP-3838962-A1 STABLE MODIFIED POLYMER POLYOL DISPERSIONS Repsol, S.A. (ES) 2021-06-23 EP claimed
US-8378037-B2 Moisture-curable silylated polyurea and adhesive, sealant and coating compositions containing same MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2013-02-19 US claimed
EP-2231740-B1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MAT INC (US) 2011-08-24 EP claimed
EP-2231740-A1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME Momentive Performance Materials Inc. (US) 2010-09-29 EP claimed
WO-2009085285-A1 MOISTURE-CURABLE SILYLATED POLYUREA AND ADHESIVE, SEALANT AND COATING COMPOSITIONS CONTAINING SAME MOMENTIVE PERFORMANCE MATERIALS INC. (US) 2009-07-09 WO claimed
US-20090171040-A1 Moisture-curable silylated polyurea and adhesive, sealant and coating compositions containing same MOMENTIVE PERFORMANCE MATERIALS INC. 2009-07-02 US claimed
EP-4735496-A1 SILICONE LEATHER COATING COMPOSITION Dow Silicones Corporation (US) 2026-05-06 EP disclosed
US-20250327242-A1 SILICONE LEATHER DOW GLOBAL TECHNOLOGIES LLC (US) 2025-10-23 US disclosed
EP-4619451-A1 MODIFIED POLYMER POLYOLS Repsol, S.A. (ES) 2025-09-24 EP disclosed
EP-4579937-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION FOR BATTERY INSULATION MEMBER, AND BATTERY INSULATION MEMBER Toray Industries, Inc. (JP) 2025-07-02 EP disclosed
CN-115989202-B Polyarylene sulfide resin composition, molded article, and method for producing same DIC株式会社 2025-05-27 CN disclosed
US-6121388-A A MOLDING MATERIAL OF POLYAMIDE RESIN, A LIQUID-CRYSTALLINE RESIN, AND AN ACID ANHYDRIDE SELECTED FROM SUCCINIC, NAPHTHALIC OR PHTHALIC ANHYDRIDE; BOX-TYPE MOLDINGS WITH THIN-WALL PARTS; GOOD FLUIDITY IN MOLD AND MOLDABLITY; TORAY INDUSTRIES, INC. (JP) 2000-09-19 US disclosed
EP-1033388-A1 THERMOPLASTIC RESIN COMPOSITION KUREHA KAGAKU KOGYO KABUSHIKI KAISHA (JP) 2000-09-06 EP disclosed
EP-1022314-A1 POLYAMIDE RESIN COMPOSITION AND PROCESS FOR PRODUCING THE SAME TORAY INDUSTRIES, INC. (JP) 2000-07-26 EP disclosed
EP-0957132-A1 Polyamide resin composition TORAY INDUSTRIES, INC. (JP) 1999-11-17 EP disclosed
EP-0888880-A1 CONDUCTIVE MULTILAYER BLOW MOLDING AND CONDUCTIVE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1999-01-07 EP disclosed
EP-0852249-A1 POLYPHENYLENE SULFIDE RESIN COMPOSITION TORAY INDUSTRIES, INC. (JP) 1998-07-08 EP disclosed