SCHEMBL19124641

SCHEMBL19124641

CO[SiH](CCCCCCCC1CCC2OC2C1)OC

nearest known ligand 0.33

Predicted protein targets (top 2)

geneUniProtsupporting neighboursconfidence
PTGS1 P23219 1/20 0.33
PTGS2 P35354 1/20 0.33

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19124445 1.00 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL6048406 1.00 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL17766111 1.00 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL6048422 0.98 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL296957 0.94 PTGS1 (0.34) PTGS1PTGS2
SCHEMBL19282186 0.92 PTGS1 (0.33) PTGS1PTGS2
SCHEMBL384757 0.87 PTGS1 (0.35) PTGS1PTGS2
SCHEMBL19124411 0.86 PTGS1 (0.30) PTGS1PTGS2
SCHEMBL19124643 0.86 PTGS1 (0.30) PTGS1PTGS2
SCHEMBL17766142 0.86 PTGS1 (0.30) PTGS1PTGS2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3312211-B1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE DAICEL CORP (JP) 2026-05-27 EP disclosed
US-12312494-B2 Resin composition, method for producing same, and multi-liquid curable resin composition KANEKA CORPORATION (JP) 2025-05-27 US disclosed
EP-3626795-B1 CURABLE COMPOSITION FOR ADHESIVE AGENTS, ADHESIVE SHEET, CURED ARTICLE, LAMINATE, AND DEVICE DAICEL CORP (JP) 2024-10-02 EP disclosed
US-12091588-B2 Curable composition for adhesive agents, adhesive sheet, cured article, laminate, and device DAICEL CORPORATION (JP) 2024-09-17 US disclosed
US-20220340777-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION KANEKA CORPORATION (JP) 2022-10-27 US disclosed
WO-2022202173-A1 CURABLE RESIN COMPOSITION AND USE THEREOF 株式会社カネカ 2022-09-29 WO disclosed
US-20220073747-A1 RESIN COMPOSITION, METHOD FOR PRODUCING SAME, AND MULTI-LIQUID CURABLE RESIN COMPOSITION KANEKA CORPORATION (JP) 2022-03-10 US disclosed
US-11066586-B2 Curable composition, adhesive sheet, cured product, laminate, method for producing adhesive sheet, and device DAICEL CORPORATION (JP) 2021-07-20 US disclosed
EP-3235845-B1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE KANEKA CORP (JP) 2020-07-15 EP disclosed
US-20200148926-A1 CURABLE COMPOSITION FOR ADHESIVE AGENTS, ADHESIVE SHEET, CURED ARTICLE, LAMINATE, AND DEVICE DAICEL CORPORATION (JP) 2020-05-14 US disclosed
EP-3626795-A1 CURABLE COMPOSITION FOR ADHESIVE AGENT, ADHESIVE SHEET, CURED ARTICLE, LAMINATE, AND APPARATUS Daicel Corporation (JP) 2020-03-25 EP disclosed
US-10563088-B2 Photocurable and thermosetting resin composition, cured product, and laminate KANEKA CORPORATION (JP) 2020-02-18 US disclosed
US-20180171193-A1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, METHOD FOR PRODUCING ADHESIVE SHEET, AND DEVICE DAICEL CORPORATION (JP) 2018-06-21 US disclosed
EP-3312211-A1 CURABLE COMPOSITION, ADHESIVE SHEET, CURED PRODUCT, LAMINATE, PRODUCTION METHOD FOR ADHESIVE SHEET, AND DEVICE Daicel Corporation (JP) 2018-04-25 EP disclosed
EP-3235845-A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE Kaneka Corporation (JP) 2017-10-25 EP disclosed
US-20170283649-A1 PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE KANEKA CORPORATION (JP) 2017-10-05 US disclosed
EP-3202811-A1 ACTINIC RADIATION CURABLE COMPOSITION Kaneka Corporation (JP) 2017-08-09 EP disclosed
US-20170204231-A1 ACTINIC RADIATION CURABLE COMPOSITION KANEKA CORPORATION (JP) 2017-07-20 US disclosed