SCHEMBL19252586

SCHEMBL19252586

CC/C(C)=C(\O)CC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL16519774 1.00
SCHEMBL690677 0.79
SCHEMBL27824858 0.79
SCHEMBL14395906 0.79
SCHEMBL3401569 0.74
SCHEMBL1287804 0.74
SCHEMBL7614582 0.74
SCHEMBL3401573 0.74
SCHEMBL1287802 0.74
SCHEMBL711278 0.72

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 32 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20260133485-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND UNDERLAYER FILM-FORMING COMPOSITION JSR CORPORATION (JP) 2026-05-14 US disclosed
US-20260093180-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE AND COMPOSITION FOR FILM FORMATION JSR CORPORATION (JP) 2026-04-02 US disclosed
EP-4606882-A1 CLEANING SOLUTION, METHOD FOR CLEANING SUBSTRATE, AND METHOD FOR FORMING METAL-CONTAINING FILM SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-08-27 EP disclosed
US-20250263639-A1 Cleaning Solution, Method For Cleaning Substrate, And Method For Forming Metal Containing Film SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-08-21 US disclosed
EP-4600734-A1 PATTERN FORMING METHOD AND LAMINATE Shin-Etsu Chemical Co., Ltd. (JP) 2025-08-13 EP disclosed
US-20250246429-A1 Pattern Forming Method And Laminate SHIN-ETSU CHEMICAL CO., LTD. (JP) 2025-07-31 US disclosed
WO-2025079496-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE JSR株式会社 2025-04-17 WO disclosed
CN-119678105-A Method for producing semiconductor substrate and composition for film formation JSR株式会社 2025-03-21 CN disclosed
WO-2025041533-A1 SEMICONDUCTOR SUBSTRATE PRODUCTION METHOD AND FILM-FORMING COMPOSITION JSR株式会社 2025-02-27 WO disclosed
WO-2025013817-A1 METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE, AND UNDERLAYER FILM-FORMING COMPOSITION FOR FIRST METAL-CONTAINING RESIST JSR株式会社 2025-01-16 WO disclosed
US-20190094689-A1 RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2019-03-28 US disclosed
US-20190094691-A1 RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2019-03-28 US disclosed
US-20190033713-A1 RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2019-01-31 US disclosed
US-20180356725-A1 RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2018-12-13 US disclosed
US-10120277-B2 Radiation-sensitive composition and pattern-forming method JSR CORPORATION (JP) 2018-11-06 US disclosed
US-10108088-B2 Radiation-sensitive composition and pattern-forming method JSR CORPORATION (JP) 2018-10-23 US disclosed
EP-3244262-A1 RADIATION-SENSITIVE COMPOSITION AND PATTERN FORMING METHOD JSR Corporation (JP) 2017-11-15 EP disclosed
US-20170299962-A1 RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-10-19 US disclosed
US-20170242337-A1 RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-08-24 US disclosed
US-20170242336-A1 RADIATION-SENSITIVE COMPOSITION AND PATTERN-FORMING METHOD JSR CORPORATION (JP) 2017-08-24 US disclosed