SCHEMBL19309372

SCHEMBL19309372

CC(c1ccccc1)[Si](C)(C)c1ccccc1

nearest known ligand 0.42

Predicted protein targets (top 15)

geneUniProtsupporting neighboursconfidence
ESR1 P03372 1/20 0.41
ESR2 Q92731 1/20 0.41
TAAR1 Q96RJ0 3/20 0.38
ADRA2A P08913 1/20 0.37
ADRA2C P18825 1/20 0.37
CYP2D6 P10635 1/20 0.37
LMNA P02545 1/20 0.37
HIF1A Q16665 1/20 0.37
KDM4E B2RXH2 1/20 0.37
ALDH1A1 P00352 1/20 0.35
TRPA1 O75762 1/20 0.35
ALOX5 P09917 1/20 0.35
DPP4 P27487 2/20 0.35
F2 P00734 1/20 0.35
TSHR P16473 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12853318 0.87 LMNA (0.39) ESR1ESR2LMNAALOX5TSHR
SCHEMBL16362246 0.82 ESR1 (0.33) ESR1ESR2
SCHEMBL22555841 0.78 HTR2A (0.39) ESR1ESR2TAAR1ADRA2AADRA2C
SCHEMBL23557563 0.77 ESR1 (0.41) ESR1ESR2TAAR1ADRA2AADRA2C
SCHEMBL17886084 0.77 ESR1 (0.41) ESR1ESR2TAAR1ADRA2AADRA2C
SCHEMBL6420857 0.77 TAAR1 (0.42) TAAR1ADRA2AADRA2CCYP2D6LMNA
SCHEMBL6671378 0.75 TSHR (0.43) TAAR1ADRA2AADRA2CCYP2D6LMNA
SCHEMBL9085359 0.74 TSHR (0.44) ESR1ESR2TAAR1LMNAKDM4E
SCHEMBL9088011 0.74 LMNA (0.41) ESR1ESR2ADRA2AADRA2CCYP2D6
SCHEMBL4951403 0.73 TYR (0.44) ESR1ESR2TAAR1ADRA2AADRA2C

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10179840-B2 Condensation curable resin composition and semiconductor package SHIN-ETSU CHEMICAL CO., LTD. (JP) 2019-01-15 US disclosed
US-20170306098-A1 CONDENSATION CURABLE RESIN COMPOSITION AND SEMICONDUCTOR PACKAGE SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-10-26 US disclosed
US-9751989-B2 Condensation curable resin composition and semiconductor package SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-09-05 US disclosed