SCHEMBL19316152

SCHEMBL19316152

CC1C=C(OCC2CO2)C=CC1C(C)(C)c1ccc(C(C)(c2ccc(OCCCO)cc2)c2ccc(OCC3CO3)cc2)cc1

nearest known ligand 0.45

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
▸ TP53 P04637 3/20 0.45
▸ TSHR P16473 3/20 0.45
▸ ALDH1A1 P00352 3/20 0.45
▸ MAPT P10636 2/20 0.45
▸ HPGD P15428 2/20 0.45
▸ MEN1 O00255 2/20 0.45
▸ KMT2A Q03164 2/20 0.45
▸ HIF1A Q16665 2/20 0.45
▸ CYP1A2 P05177 1/20 0.45
▸ PPARG P37231 1/20 0.45
▸ PKM P14618 2/20 0.35
▸ LMNA P02545 1/20 0.35
▸ GAA P10253 1/20 0.35
▸ TDP1 Q9NUW8 1/20 0.33
▸ CYP3A4 P08684 2/20 0.31
▸ SMN1; SMN2 Q16637 2/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL22854462 0.81 ALDH1A1 (0.53) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL17176161 0.79 ALDH1A1 (0.72) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL20001315 0.77 MEN1 (0.59) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL31215 0.76 ALDH1A1 (0.78) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL24385166 0.73 ALDH1A1 (0.81) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL14397616 0.73 TDP1 (0.59) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL15014708 0.73 ALDH1A1 (0.81) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL614315 0.73 ALDH1A1 (0.81) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL16693565 0.73 ALDH1A1 (0.72) TP53TSHRALDH1A1MAPTHPGD
SCHEMBL21661578 0.72 ALDH1A1 (0.53) TP53TSHRALDH1A1MAPTHPGD

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-2657963-B1 Wafer-trilayer adhesive layer-support composite, wafer support with trilayer adhesive layer for use in wafer processing, trilayer adhesive layer for use in wafer processing, method of manufacturing said composite and method of manufacturing a thin wafer using said composite SHINETSU CHEMICAL CO (JP) 2017-09-06 — — EP disclosed
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