SCHEMBL193213

SCHEMBL193213

CC(C)C(C)(C)CC(C)(C)C(=O)OO

nearest known ligand 0.31

Predicted protein targets (top 1)

geneUniProtsupporting neighboursconfidence
PIK3CD O00329 1/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24180771 0.83 DGAT1 (0.40)
SCHEMBL15164 0.81
SCHEMBL21511762 0.81
SCHEMBL10433450 0.81
SCHEMBL27651340 0.78 TSHR (0.38)
SCHEMBL284815 0.76
SCHEMBL4387251 0.75 MAPK1 (0.31)
SCHEMBL24349883 0.75 CYP4F2 (0.32)
Pivalate SCHEMBL2495562 0.74 TSHR (0.31)
SCHEMBL20623556 0.73

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 917 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12448470-B2 Polymerizable composition for optical material, molded product, optical material, and plastic lens and method for manufacturing same MITSUI CHEMICALS, INC. (JP) 2025-10-21 US claimed
WO-2023140097-A1 METHOD FOR MANUFACTURING MODIFIED ALIPHATIC OR ALIPHATIC AROMATIC THERMOPLASTIC POLYESTER RESIN 株式会社カネカ 2023-07-27 WO claimed
WO-2023140096-A1 MODIFIED ALIPHATIC POLYESTER-BASED RESIN AND COMPOSITION OR MOLDED BODY THEREOF 株式会社カネカ 2023-07-27 WO claimed
CN-105717747-B Photosensitive resin composition and application thereof 奇美实业股份有限公司 2021-12-21 CN claimed
CN-105717743-B Photosensitive resin composition and application thereof 奇美实业股份有限公司 2021-12-21 CN claimed
EP-3075750-B1 METHOD FOR PREPARING VINYL CHLORIDE-BASED RESIN HANWHA CHEMICAL CORP (KR) 2020-01-08 EP claimed
US-6051617-A POLYPROPYLENE RESIN GRAFT POLYMERIZED TO VINYL COMONOMER JSP CORPORATION (JP) 2000-04-18 US claimed
EP-0823443-A2 Foamed particles of modified polypropylene resin and method of preparing same JSP CORPORATION (JP) 1998-02-11 EP claimed
WO-2026105828-A1 ADHESIVE TAPE FOR SEMICONDUCTOR MANUFACTURING PROCESS, AND METHOD FOR MANUFACTURING SEMICONDUCTOR CHIP 積水化学工業株式会社 2026-05-21 WO disclosed
WO-2026105817-A1 ADHESIVE FILM AND WOUND BODY 積水化学工業株式会社 2026-05-21 WO disclosed
CN-122070346-A Adhesive composition, connection structure, and method for producing connection structure 株式会社力森诺科 2026-05-19 CN disclosed
WO-2026100231-A1 CURABLE RESIN COMPOSITION, ADHESIVE, SEALING MATERIAL, CURED PRODUCT, SEMICONDUCTOR DEVICE, AND ELECTRONIC COMPONENT ナミックス株式会社 2026-05-15 WO disclosed
WO-2026100494-A1 PRODUCTION METHOD FOR ANTISTATIC LAYER AND PRODUCTION METHOD FOR OPTICAL MULTILAYER BODY 日東電工株式会社 2026-05-15 WO disclosed
EP-4733334-A1 METHACRYLIC RESIN AND METHOD FOR PRODUCING SAME, METHACRYLIC RESIN COMPOSITION, AND MOLDED BODY Kuraray Co., Ltd. (JP) 2026-04-29 EP disclosed
EP-0277608-B1 Graft polymerization preformer and method of manufacturing the same NIPPON OILS & FATS CO LTD (JP) 1994-05-18 EP disclosed
US-5194536-A Low molecular weight, in presence of unsaturated epoxy compound SHIN-ETSU CHEMICAL CO., LTD. (JP) 1993-03-16 US disclosed
EP-0508349-A1 Suspension polymerization of vinyl chloride SHIN-ETSU CHEMICAL CO., LTD. (JP) 1992-10-14 EP disclosed
EP-0289933-A2 Graft polymerization precurser and method manufacturing the same NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1988-11-09 EP disclosed
EP-0279430-A2 The method of manufacturing a grafted resin composition NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1988-08-24 EP disclosed
EP-0277608-A2 Graft polymerization preformer and method of manufacturing the same NIPPON OIL AND FATS COMPANY, LIMITED (JP) 1988-08-10 EP disclosed