Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19409211 | 0.98 | MEN1 (0.35) | MEN1KMT2A | |
| SCHEMBL19409217 | 0.98 | MEN1 (0.35) | MEN1KMT2A | |
| SCHEMBL7110260 | 0.95 | MEN1 (0.31) | MEN1KMT2A | |
| SCHEMBL17239659 | 0.89 | MEN1 (0.41) | MEN1KMT2A | |
| SCHEMBL19409199 | 0.88 | — | — | |
| SCHEMBL21802952 | 0.87 | MEN1 (0.33) | MEN1KMT2A | |
| SCHEMBL21802982 | 0.85 | MEN1 (0.35) | MEN1KMT2A | |
| SCHEMBL21802976 | 0.85 | MEN1 (0.35) | MEN1KMT2A | |
| SCHEMBL19409188 | 0.83 | NPC1 (0.35) | MEN1KMT2A | |
| SCHEMBL21802961 | 0.81 | MEN1 (0.31) | MEN1KMT2A |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 8 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110651336-B | Conductive paste composition, electrode device comprising same, and method for producing conductive paste composition | 株式会社钟化 | 2022-05-17 | — | — | CN | disclosed |
| US-11066509-B2 | Conductive paste composition, device comprising electrode formed from same, and method for producing conductive paste composition | KANEKA CORPORATION (JP) | 2021-07-20 | — | — | US | disclosed |
| EP-3235845-B1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | KANEKA CORP (JP) | 2020-07-15 | — | — | EP | disclosed |
| US-20200095370-A1 | CONDUCTIVE PASTE COMPOSITION, DEVICE COMPRISING ELECTRODE FORMED FROM SAME, AND METHOD FOR PRODUCING CONDUCTIVE PASTE COMPOSITION | KANEKA CORPORATION (JP) | 2020-03-26 | — | — | US | disclosed |
| US-10563088-B2 | Photocurable and thermosetting resin composition, cured product, and laminate | KANEKA CORPORATION (JP) | 2020-02-18 | — | — | US | disclosed |
| CN-110651336-A | Conductive paste composition, device including electrode formed from conductive paste composition, and method for producing conductive paste composition | 株式会社钟化 | 2020-01-03 | — | — | CN | disclosed |
| EP-3235845-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT AND LAMINATE | Kaneka Corporation (JP) | 2017-10-25 | — | — | EP | disclosed |
| US-20170283649-A1 | PHOTOCURABLE AND THERMOSETTING RESIN COMPOSITION, CURED PRODUCT, AND LAMINATE | KANEKA CORPORATION (JP) | 2017-10-05 | — | — | US | disclosed |