Sugi Predict

Sugi Predict / Compounds / SCHEMBL19439766

SCHEMBL19439766

SCHEMBL19439766

CCn1c2ccc(C(=O)c3ccccc3)cc2c2cc(/C(CCC3CCCCC3)=N/OC(C)=O)ccc21

nearest known ligand 0.42

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ CNR2 P34972 3/20 0.42
▸ NPC1 O15118 1/20 0.41
▸ L3MBTL1 Q9Y468 1/20 0.39
▸ KMT2A Q03164 3/20 0.39
▸ MEN1 O00255 2/20 0.39
▸ ALDH1A1 P00352 2/20 0.39
▸ THRB P10828 1/20 0.39
▸ PTGER4 P35408 2/20 0.39
▸ KDM4E B2RXH2 2/20 0.39
▸ LMNA P02545 1/20 0.39
▸ MAPT P10636 1/20 0.39
▸ RAB9A P51151 1/20 0.38
▸ HPGD P15428 1/20 0.37
▸ HTT P42858 1/20 0.37
▸ RORC P51449 2/20 0.37
▸ TUBB4A P04350 1/20 0.37
▸ TUBB P07437 1/20 0.37
▸ TUBA3C P0DPH7 1/20 0.37
▸ TUBA1B P68363 1/20 0.37
▸ TUBA4A P68366 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL24394442 0.92 CNR2 (0.37) CNR2NPC1L3MBTL1KMT2AMEN1
SCHEMBL17540437 0.92 NPC1 (0.48) CNR2NPC1KMT2AMEN1ALDH1A1
SCHEMBL20653027 0.91 CNR2 (0.39) CNR2NPC1L3MBTL1KMT2AMEN1
SCHEMBL31650942 0.89 KMT2A (0.38) CNR2NPC1L3MBTL1KMT2AMEN1
SCHEMBL21253182 0.89 KMT2A (0.38) CNR2NPC1L3MBTL1KMT2AMEN1
SCHEMBL29378382 0.89 KMT2A (0.38) CNR2NPC1L3MBTL1KMT2AMEN1
SCHEMBL19632436 0.89 KMT2A (0.38) CNR2NPC1L3MBTL1KMT2AMEN1
SCHEMBL16548356 0.89 KMT2A (0.38) CNR2NPC1L3MBTL1KMT2AMEN1
SCHEMBL23552994 0.87 CNR2 (0.47) CNR2NPC1L3MBTL1KMT2AMEN1
SCHEMBL17540424 0.87 KMT2A (0.38) CNR2NPC1KMT2AMEN1ALDH1A1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 10 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 — — US disclosed
US-20240210827-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2024-06-27 — — US disclosed
US-11809079-B2 Photosensitive resin composition, polyimide production method, and semiconductor device ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-11-07 — — US disclosed
US-11809079-B2 Photosensitive resin composition, polyimide production method, and semiconductor device ASAHI KASEI KABUSHIKI KAISHA (JP) 2023-11-07 — — US disclosed
US-20220269170-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2022-08-25 — — US disclosed
US-20200409263-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-12-31 — — US disclosed
US-20200301273-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-09-24 — — US disclosed
US-10719016-B2 Photosensitive resin composition, polyimide production method, and semiconductor device ASAHI KASEI KABUSHIKI KAISHA (JP) 2020-07-21 — — US disclosed
US-20190072850-A1 PHOTOSENSITIVE RESIN COMPOSITION, POLYIMIDE PRODUCTION METHOD, AND SEMICONDUCTOR DEVICE ASAHI KASEI KABUSHIKI KAISHA (JP) 2019-03-07 — — US disclosed
WO-2017170600-A1 PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR MANUFACTURING CURED RELIEF PATTERN, AND SEMICONDUCTOR APPARATUS 旭化成株式会社 2017-10-05 — — WO disclosed