⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL27624771 | 1.00 | — | — | |
| SCHEMBL11421642 | 1.00 | ALDH1A1 (0.91) | — | |
| SCHEMBL28215135 | 0.96 | — | — | |
| Methyl Alcohol SCHEMBL28282955 | 0.96 | ALDH1A1 (0.83) | — | |
| SCHEMBL14740684 | 0.96 | — | — | |
| SCHEMBL15529135 | 0.96 | — | — | |
| SCHEMBL1331977 | 0.95 | — | — | |
| SCHEMBL523 | 0.95 | — | — | |
| SCHEMBL1331774 | 0.95 | — | — | |
| SCHEMBL9866292 | 0.95 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 97 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-110229319-A | A kind of preparation method of the high gas barrier copolyesters of high molecular weight | 中国科学院宁波材料技术与工程研究所 | 2019-09-13 | — | — | CN | claimed |
| CN-106824276-B | The synthetic method of 3-HPA | 中国石油化工股份有限公司 | 2019-08-06 | — | — | CN | claimed |
| US-9970156-B2 | Steel cord for rubber reinforcement and method for manufacturing the same | HONGDUK INDUSTRIAL CO., LTD. (KR) | 2018-05-15 | — | — | US | claimed |
| CN-106824276-A | The synthetic method of 3-HPA | 中国石油化工股份有限公司 | 2017-06-13 | — | — | CN | claimed |
| US-20160130750-A1 | STEEL CORD FOR RUBBER REINFORCEMENT AND METHOD FOR MANUFACTURING THE SAME | HONGDUK INDUSTRIAL CO. LTD. (KR) | 2016-05-12 | — | — | US | claimed |
| EP-3017889-A1 | STEEL CORD FOR RUBBER REINFORCEMENT AND METHOD FOR MANUFACTURING THE SAME | Hongduk Industrial Co. Ltd. (KR) | 2016-05-11 | — | — | EP | claimed |
| EP-1543074-B1 | UV-CURABLE RESIN COMPOSITION FOR CLADDING OPTICAL FIBER | SSCP CO LTD (KR) | 2008-02-27 | — | — | EP | claimed |
| US-7046904-B2 | UV-curable resin composition for cladding optical fiber | SSCP CO., LTD. (KR) | 2006-05-16 | — | — | US | claimed |
| US-20060067638-A1 | Uv-curable resin composition for cladding optical fiber | LUVANTIX CO., LTD. (KR) | 2006-03-30 | — | — | US | claimed |
| EP-1543074-A4 | UV-CURABLE RESIN COMPOSITION FOR CLADDING OPTICAL FIBER | SSCP CO LTD (KR) | 2006-01-04 | — | — | EP | claimed |
| EP-1543074-A1 | UV-CURABLE RESIN COMPOSITION FOR CLADDING OPTICAL FIBER | SSCP Co., Ltd. (KR) | 2005-06-22 | — | — | EP | claimed |
| WO-2004024814-A1 | UV-CURABLE RESIN COMPOSITION FOR CLADDING OPTICAL FIBER | SSCP CO., LTD. (KR) | 2004-03-25 | — | — | WO | claimed |
| CN-1357933-A | Prepn of LiCoC2 as nanometer positive electrode material for lithium ion cell | CHEMISTRY & CHEMICAL ENGINEERI (CN) | 2002-07-10 | — | — | CN | claimed |
| US-20250243388-A1 | CONDUCTIVE PASTE AND CURED PRODUCT | THREEBOND CO., LTD. (JP) | 2025-07-31 | — | — | US | disclosed |
| US-20240224413-A1 | WIRING SUBSTRATE | RESONAC CORPORATION (JP) | 2024-07-04 | — | — | US | disclosed |
| EP-3798244-B1 | RESIN COMPOSITION, POLISHING PAD, AND METHOD FOR PRODUCING POLISHING PAD | RESONAC CORP (JP) | 2024-03-06 | — | — | EP | disclosed |
| EP-0534479-A1 | Electrophotographic material for color proofing | Fuji Photo Film Co., Ltd. (JP) | 1993-03-31 | — | — | EP | disclosed |
| US-4652619-A | Epoxy impregnating resin composition | MITSUBISHI DENKI KABUSHIKI KAISHA (JP) | 1987-03-24 | — | — | US | disclosed |
| US-4488999-A | TREATING WITH AMMONIUM, SODIUM, OR POTASSIUM OXALATE, THEN FILTRATION | DYNAMIT NOBEL AG (DE) | 1984-12-18 | — | — | US | disclosed |
| US-4309519-A | TREATING WITH LOW-SHRINKAGE RESIN INCLUDING UNSATURATED POLYESTER HAVING UNITS OF DICYCLOPENTADIENE | HITACHI CHEMICAL COMPANY, LTD. (JP) | 1982-01-05 | — | — | US | disclosed |