SCHEMBL195331

SCHEMBL195331

CCOC(=O)C(C)OC

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL12951628 1.00
SCHEMBL8223259 1.00
SCHEMBL22486534 0.91 ALDH1A1 (0.39)
SCHEMBL13235972 0.91 ALDH1A1 (0.39)
SCHEMBL22486478 0.91 ALDH1A1 (0.39)
SCHEMBL16981761 0.84 GAA (0.44)
SCHEMBL5142918 0.82 ALDH1A1 (0.45)
SCHEMBL15649073 0.81 ALDH1A1 (0.48)
SCHEMBL22486482 0.81 ALDH1A1 (0.31)
SCHEMBL668313 0.81 TSHR (0.39)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Appears in 3296 patents — a generic fragment claimed broadly, so it's down-weighted as IP noise. Top by claim status then date:

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-119087744-A Immersion photoresist composition 万华化学集团股份有限公司 2024-12-06 CN claimed
WO-2024134395-A1 THIN FILM FOR DEVELOPING AN ARRAY-LIKE PATTERN AND PROCESS FOR ITS PREPARATION CHAIRMAN, DEFENCE RESEARCH AND DEVELOPMENT ORGANIZATION (IN) 2024-06-27 WO claimed
CN-110874025-B Diluent composition, substrate processing method and semiconductor element manufacturing method 易案爱富科技有限公司 2024-05-24 CN claimed
CN-117551259-A Epoxy resin composition, modified epoxy resin, alkali-soluble polyurethane resin composition, alkali-soluble polyurethane resin, and solder resist 杭州福斯特电子材料有限公司 2024-02-13 CN claimed
CN-113801358-B Preparation method of aluminum-plastic composite film based on light click UV curing 华南理工大学 2022-09-20 CN claimed
CN-114390926-A Sake replica prepared from individual components 艾娃食品实验室股份有限公司 2022-04-22 CN claimed
US-11220659-B2 Thinner composition ENF TECHNOLOGY CO., LTD. (KR) 2022-01-11 US claimed
CN-113801358-A Preparation method of aluminum-plastic composite film based on light click UV curing 华南理工大学 2021-12-17 CN claimed
CN-113736308-A Preparation method of double-color imitation aluminum-plated film 广东新天丽控股有限公司 2021-12-03 CN claimed
EP-3830626-A1 METHOD FOR THE PREPARATION OF BIOLOGICAL, CYTOLOGICAL, HISTOLOGICAL AND AUTOPSICAL SAMPLES AND COMPOSITION FOR MOUNTING MICROSCOPE SLIDES Diapath S.p.A. (IT) 2021-06-09 EP claimed
EP-1271244-B1 Method for fabricating an organic thin film MATSUSHITA ELECTRIC INDUSTRIAL CO LTD (JP) 2004-08-25 EP claimed
EP-1271244-A1 Method for fabricating an organic thin film MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2003-01-02 EP claimed
US-20020192983-A1 Method for fabricating organic thin film MATSUSHITA ELECTRIC INDUSTRIAL CO., LTD. (JP) 2002-12-19 US claimed
EP-0832082-B1 N-HETEROARYL-PYRIDINESULFONAMIDE DERIVATIVES AND THEIR USE AS ENDOTHELIN ANTAGONISTS ASTRAZENECA AB (SE) 2001-11-21 EP claimed
US-6183942-B1 CAN BE USED IN WASHING AND REMOVING THE UNNECESSARY SPIN-ON-GLASS (SOG) OF AN SOG LAYER AT EDGES AND BACKSIDE ON SEMICONDUCTOR SUBSTRATES DONGJIN SEMICHEM CO., LTD. (KR) 2001-02-06 US claimed
CN-1271113-A Diluent composition for removing unnecessary sensitive resin DONGJIN THEMIKAN CO LTD (KR) 2000-10-25 CN claimed
US-5456853-A Ether esters and carbonates; nontoxic; evironmentally safe RUST-OLEUM CORPORATION (US) 1995-10-10 US claimed
EP-0211667-B1 RADIATION-SENSITIVE RESIN COMPOSITION JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1992-03-11 EP claimed
EP-0457367-A1 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1991-11-21 EP claimed
EP-0211667-A2 Radiation-sensitive resin composition JAPAN SYNTHETIC RUBBER CO., LTD. (JP) 1987-02-25 EP claimed