⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL3789059 | 0.87 | — | — | |
| SCHEMBL1508939 | 0.87 | — | — | |
| SCHEMBL8399996 | 0.87 | — | — | |
| SCHEMBL31119465 | 0.87 | — | — | |
| SCHEMBL30713445 | 0.82 | — | — | |
| SCHEMBL29351179 | 0.82 | — | — | |
| SCHEMBL29466064 | 0.82 | — | — | |
| SCHEMBL29371177 | 0.82 | — | — | |
| SCHEMBL29352049 | 0.82 | — | — | |
| SCHEMBL30142614 | 0.82 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 718 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12484348-B2 | Substrate, method for forming the same, display device and for forming the same | Beijing Boe Technology Development Co., Ltd. (CN) | 2025-11-25 | — | — | US | claimed |
| CN-119286475-A | Preparation method of graphene reinforced low-melting-point metal phase-change composite material | 北京科技大学 | 2025-01-10 | — | — | CN | claimed |
| CN-112217492-B | SAW filter | 北京梦之墨科技有限公司 | 2024-11-22 | — | — | CN | claimed |
| CN-118895109-A | Thermal interface material and preparation method thereof | 深圳先进电子材料国际创新研究院 | 2024-11-05 | — | — | CN | claimed |
| CN-109216286-B | Semiconductor device with a semiconductor device having a plurality of semiconductor chips | 富士电机株式会社 | 2023-09-19 | — | — | CN | claimed |
| CN-116646486-A | Inert lithium powder, preparation method thereof, lithium ion battery electrode material containing inert lithium powder and lithium ion battery | 深圳市研一新材料有限责任公司 | 2023-08-25 | — | — | CN | claimed |
| CN-116581294-A | Inert lithium powder and preparation method thereof, lithium ion battery electrode material and lithium ion battery | 深圳市研一新材料有限责任公司 | 2023-08-11 | — | — | CN | claimed |
| US-20230006107-A1 | SUBSTRATE, METHOD FOR FORMING THE SAME, DISPLAY DEVICE AND FOR FORMING THE SAME | Beijing Boe Technology Development Co., Ltd. (CN) | 2023-01-05 | — | — | US | claimed |
| CN-114974656-A | Nano composite low-temperature slurry, preparation method and application thereof | 深圳市百柔新材料技术有限公司 | 2022-08-30 | — | — | CN | claimed |
| CN-114864134-A | Nano-alloy composite low-temperature slurry, preparation method and application thereof | 深圳市百柔新材料技术有限公司 | 2022-08-05 | — | — | CN | claimed |
| CN-1738039-A | Semiconductor device and manufacturing method of the same | TOKYO SHIBAURA ELECTRIC CO (JP) | 2006-02-22 | — | — | CN | claimed |
| US-20060033214-A1 | Semiconductor device and manufacturing method of the same | KABUSHIKI KAISHA TOSHIBA | 2006-02-16 | — | — | US | claimed |
| US-20050194695-A1 | Method of assembling chips | QUALCOMM INCORPORATED | 2005-09-08 | — | — | US | claimed |
| EP-1038628-B1 | UNLEADED SOLDER POWDER AND PRODUCTION METHOD THEREFOR | MITSUI MINING & SMELTING CO (JP) | 2005-05-04 | — | — | EP | claimed |
| US-20040126927-A1 | Method of assembling chips | QUALCOMM INCORPORATED | 2004-07-01 | — | — | US | claimed |
| US-20030189260-A1 | FLIP-CHIP BONDING STRUCTURE AND METHOD THEREOF | ADVANCED SEMICONDUCTOR ENGINEERING, INC. (TW) | 2003-10-09 | — | — | US | claimed |
| CN-1105619-C | Unleaded solder powder and production method therefor | MITSUI MINING & SMELTING CO (JP) | 2003-04-16 | — | — | CN | claimed |
| US-6334905-B1 | Unleaded solder powder and production method therefor | MITSUI MINING AND SMELTING COMPANY, LTD. (JP) | 2002-01-01 | — | — | US | claimed |
| CN-1286655-A | Unleaded solder powder and production method therefor | MITSUI MINING & SMELTING CO (JP) | 2001-03-07 | — | — | CN | claimed |
| EP-1038628-A1 | UNLEADED SOLDER POWDER AND PRODUCTION METHOD THEREFOR | Mitsui Mining & Smelting Co., Ltd. (JP) | 2000-09-27 | — | — | EP | claimed |