⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL31067874 | 0.89 | — | — | |
| SCHEMBL196617 | 0.87 | — | — | |
| SCHEMBL29410059 | 0.87 | — | — | |
| SCHEMBL29351402 | 0.87 | — | — | |
| SCHEMBL7639136 | 0.87 | — | — | |
| SCHEMBL735757 | 0.87 | — | — | |
| SCHEMBL2515532 | 0.87 | — | — | |
| SCHEMBL29446543 | 0.87 | — | — | |
| SCHEMBL1645262 | 0.75 | — | — | |
| SCHEMBL4385132 | 0.75 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 87 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118895109-A | Thermal interface material and preparation method thereof | 深圳先进电子材料国际创新研究院 | 2024-11-05 | — | — | CN | claimed |
| CN-108620764-B | Soldering paste for low-temperature soldering and preparation method thereof | 苏州昭舜物联科技有限公司 | 2022-03-08 | — | — | CN | claimed |
| CN-110643331-B | Liquid metal heat-conducting paste and preparation method and application thereof | 云南靖创液态金属热控技术研发有限公司 | 2021-11-09 | — | — | CN | claimed |
| CN-112028601-A | Secret color ceramic product and preparation method thereof | 福建省德化贝思家居有限公司 | 2020-12-04 | — | — | CN | claimed |
| CN-210924211-U | Bending-resistant anti-release watch | 威洛克（深圳）智能科技有限公司 | 2020-07-03 | — | — | CN | claimed |
| CN-110643331-A | Liquid metal heat-conducting paste and preparation method and application thereof | 云南靖创液态金属热控技术研发有限公司 | 2020-01-03 | — | — | CN | claimed |
| CN-108265318-B | Method and device for preparing flexible battery cathode powder | 上海移宇科技股份有限公司 | 2019-12-20 | — | — | CN | claimed |
| CN-107579112-B | A kind of full liquid quantum tunneling effect device and preparation method thereof | 北京梦之墨科技有限公司 | 2018-11-16 | — | — | CN | claimed |
| CN-108795414-A | A kind of liquid metal quantum material and preparation method thereof | 北京梦之墨科技有限公司 | 2018-11-13 | — | — | CN | claimed |
| CN-108265318-A | Method and device for preparing negative electrode powder of flexible battery | 上海移宇科技股份有限公司 | 2018-07-10 | — | — | CN | claimed |
| CN-104992924-B | Flexible display device and its manufacture method | 昆山工研院新型平板显示技术中心有限公司 | 2018-05-04 | — | — | CN | claimed |
| CN-107579112-A | A kind of full liquid quantum tunneling effect device and preparation method thereof | 北京梦之墨科技有限公司 | 2018-01-12 | — | — | CN | claimed |
| CN-107573922-A | Liquid metal quantum material and preparation method thereof | 北京梦之墨科技有限公司 | 2018-01-12 | — | — | CN | claimed |
| CN-106550547-A | A kind of printed circuit color printing apparatus, method and printed circuit | 北京梦之墨科技有限公司 | 2017-03-29 | — | — | CN | claimed |
| CN-104031600-B | Insulated heat-conducting metal adhesive and manufacturing method thereof | TECHNICAL INSTITUTE OF PHYSICS AND CHEMISTRY CHINESE ACADEMY OF SCIENCES (CN) | 2016-03-23 | — | — | CN | claimed |
| CN-105220013-A | Colored liquid metal and manufacturing method thereof | CHINESE ACAD TECH INST PHYSICS | 2016-01-06 | — | — | CN | claimed |
| CN-104992924-A | Flexible display device and manufacturing method thereof | KUNSHAN NEW FLAT PANEL DISPLAY TECHNOLOGY CT CO LTD | 2015-10-21 | — | — | CN | claimed |
| CN-104031600-A | Insulated heat-conducting metal adhesive and manufacturing method thereof | CHINESE ACAD TECH INST PHYSICS | 2014-09-10 | — | — | CN | claimed |
| EP-3694704-B1 | METHOD AND ARRANGEMENT FOR PRODUCING A LABEL WITH INTEGRATED ELECTRICALLY CONDUCTIVE PATTERN | Digital Tags Finland Oy (FI) | 2024-11-27 | — | — | EP | disclosed |
| CN-1721124-A | Leadless solder | MA XIN (CN) | 2006-01-18 | — | — | CN | disclosed |