SCHEMBL19664166

SCHEMBL19664166

CC(O)C(CCCC[O])(C(C)O)C(C)O

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL7909746 0.67 TSHR (0.37)
SCHEMBL1872454 0.65
SCHEMBL5057006 0.65 GABRR1 (0.35)
SCHEMBL9283050 0.64
SCHEMBL498050 0.64
SCHEMBL28406377 0.63 ALDH1A1 (0.47)
SCHEMBL1873536 0.63 ALDH1A1 (0.41)
SCHEMBL1868734 0.63
Ammonia Solution, Strong SCHEMBL28852817 0.63
SCHEMBL4643808 0.61 FFAR1 (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-109071947-A Composition for organic electronic device sealant and the sealant using its formation 莫门蒂夫性能材料韩国株式会社 2018-12-21 CN disclosed
US-20170352836-A1 COMPOSITION FOR ORGANIC ELECTRONIC DEVICE ENCAPSULANT AND ENCAPSULANT FORMED USING THE SAME MOMENTIVE PERFORMANCE MATERIALS KOREA CO., LTD. (KR) 2017-12-07 US disclosed
EP-3252107-A1 COMPOSITION FOR ORGANIC ELECTRONIC ELEMENT ENCAPSULANT AND ENCAPSULANT FORMED USING SAME Momentive Performance Materials Korea Co., Ltd. (KR) 2017-12-06 EP disclosed