Predicted protein targets (top 3)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HSD17B10 | Q99714 | 1/20 | 0.38 |
| ▸ | TSHR | P16473 | 1/20 | 0.33 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.31 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Methoxymethane SCHEMBL27700608 | 0.82 | HSD17B10 (0.43) | HSD17B10TSHRTDP1 | |
| Hydroxyl Radical SCHEMBL28108301 | 0.82 | — | — | |
| SCHEMBL23448 | 0.82 | — | — | |
| SCHEMBL28418615 | 0.82 | HSD17B10 (0.47) | HSD17B10TSHRTDP1 | |
| Methoxymethane SCHEMBL5718797 | 0.79 | HSD17B10 (0.41) | HSD17B10TSHRTDP1 | |
| Water SCHEMBL482851 | 0.78 | — | — | |
| SCHEMBL1728920 | 0.78 | — | — | |
| SCHEMBL12570287 | 0.78 | HSD17B10 (0.45) | HSD17B10TSHRTDP1 | |
| SCHEMBL1727219 | 0.78 | — | — | |
| SCHEMBL272664 | 0.78 | HSD17B10 (0.45) | HSD17B10TSHRTDP1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 44 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-113800816-B | Epoxy plastic packaging material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2022-10-21 | — | — | CN | claimed |
| CN-111117540-B | High-strength high-heat-resistance epoxy plastic packaging material for organic bentonite modified semiconductor packaging and preparation method thereof | 江苏科化新材料科技有限公司 | 2022-04-22 | — | — | CN | claimed |
| CN-113800816-A | Epoxy plastic packaging material and preparation method and application thereof | 深圳先进电子材料国际创新研究院 | 2021-12-17 | — | — | CN | claimed |
| CN-109467881-B | Super-heat-resistant high-thermal-conductivity epoxy plastic packaging material for semiconductor packaging | 江苏科化新材料科技有限公司 | 2021-10-26 | — | — | CN | claimed |
| CN-109517336-B | Preparation method of super-heat-resistant high-thermal-conductivity epoxy plastic packaging material for semiconductor packaging | 江苏科化新材料科技有限公司 | 2021-05-28 | — | — | CN | claimed |
| CN-112679141-A | Epoxy resin composition for improving appearance of semiconductor package and preparation method thereof | 江苏科化新材料科技有限公司 | 2021-04-20 | — | — | CN | claimed |
| CN-111117540-A | High-strength high-heat-resistance epoxy plastic packaging material for organic bentonite modified semiconductor packaging and preparation method thereof | 科化新材料泰州有限公司 | 2020-05-08 | — | — | CN | claimed |
| CN-106589828-A | Environment-friendly epoxy resin composition and preparation method thereof | 科化新材料泰州有限公司 | 2017-04-26 | — | — | CN | claimed |
| EP-2334491-B1 | REINFORCED COMPOSITE MATERIAL AND PREPARATION METHOD AND APPLICATIONS THEREOF | DU PONT (US) | 2013-02-13 | — | — | EP | claimed |
| US-20110171867-A1 | REINFORCED COMPOSITE MATERIAL AND PREPARATION METHOD AND APPLICATIONS THEREOF | E.I DU PONT DE NEMOURS AND COMPANY (US) | 2011-07-14 | — | — | US | claimed |
| CN-118127858-A | Wear-resistant decorative paper and preparation method thereof | 杭州临安汇美装饰材料有限公司 | 2024-06-04 | — | — | CN | disclosed |
| CN-115521576-B | Epoxy resin material and preparation method and application thereof | 北京科化新材料科技有限公司 | 2024-05-10 | — | — | CN | disclosed |
| CN-114350295-B | Epoxy resin composition, preparation method and application thereof, epoxy resin and application thereof | 江苏中科科化新材料股份有限公司 | 2024-01-26 | — | — | CN | disclosed |
| CN-116768598-A | Fiber reinforced structural type heat insulation composite material and preparation method and application thereof | 奔朗先进材料科技(广东)有限公司 | 2023-09-19 | — | — | CN | disclosed |
| CN-112679141-B | Epoxy resin composition for improving appearance of semiconductor package and preparation method thereof | 江苏中科科化新材料股份有限公司 | 2023-03-31 | — | — | CN | disclosed |
| CN-104592827-A | Island type refrigerating cabinet | CHANGSHU CITY HENGSHIDA ELECTRIC APPLIANCE CO LTD | 2015-05-06 | — | — | CN | disclosed |
| EP-2334491-B1 | REINFORCED COMPOSITE MATERIAL AND PREPARATION METHOD AND APPLICATIONS THEREOF | DU PONT (US) | 2013-02-13 | — | — | EP | disclosed |
| US-20110171867-A1 | REINFORCED COMPOSITE MATERIAL AND PREPARATION METHOD AND APPLICATIONS THEREOF | E.I DU PONT DE NEMOURS AND COMPANY (US) | 2011-07-14 | — | — | US | disclosed |
| EP-2334491-A1 | REINFORCED COMPOSITE MATERIAL AND PREPARATION METHOD AND APPLICATIONS THEREOF | E. I. du Pont de Nemours and Company (US) | 2011-06-22 | — | — | EP | disclosed |
| WO-2010042465-A1 | REINFORCED COMPOSITE MATERIAL AND PREPARATION METHOD AND APPLICATIONS THEREOF | E. I. DU PONT DE NEMOURS AND COMPANY (US) | 2010-04-15 | — | — | WO | disclosed |