SCHEMBL19712876

SCHEMBL19712876

C=C(C=CC(=O)O)C(=O)OC.C=CC(=O)OCC(CC)CCCC.C=CC(=O)OCCO

nearest known ligand 0.59

Predicted protein targets (top 18)

geneUniProtsupporting neighboursconfidence
TSHR P16473 6/20 0.59
TDP1 Q9NUW8 2/20 0.41
HCAR2 Q8TDS4 4/20 0.40
HPGD P15428 1/20 0.39
CYP3A4 P08684 3/20 0.38
ATM Q13315 2/20 0.38
ALDH1A1 P00352 4/20 0.35
CA2 P00918 1/20 0.35
RECQL P46063 1/20 0.34
LMNA P02545 3/20 0.34
MAPK1 P28482 2/20 0.34
MMP9 P14780 1/20 0.33
MMP8 P22894 1/20 0.33
MMP14 P50281 1/20 0.33
HSD17B10 Q99714 1/20 0.32
PRSS1 P07477 1/20 0.32
PRSS2 P07478 1/20 0.32
PRSS3 P35030 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL5718145 0.94 TSHR (0.62) TSHRTDP1HCAR2HPGDCYP3A4
SCHEMBL1780860 0.94 TSHR (0.67) TSHRTDP1HCAR2HPGDCYP3A4
SCHEMBL6914564 0.93 TSHR (0.60) TSHRTDP1HCAR2HPGDCYP3A4
SCHEMBL6915106 0.91 TSHR (0.57) TSHRTDP1HCAR2HPGDCYP3A4
SCHEMBL6133308 0.87 TSHR (0.64) TSHRTDP1HCAR2HPGDCYP3A4
SCHEMBL5025197 0.87 TSHR (0.58) TSHRTDP1HCAR2HPGDCYP3A4
SCHEMBL3414119 0.86 TSHR (0.66) TSHRTDP1HCAR2HPGDCYP3A4
SCHEMBL7207107 0.86 TSHR (0.62) TSHRTDP1HCAR2HPGDCYP3A4
SCHEMBL8519821 0.86 TSHR (0.54) TSHRTDP1HCAR2HPGDCYP3A4
Acrylic Acid SCHEMBL29291566 0.86 TSHR (0.76) TSHRTDP1HCAR2HPGDCYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-107148663-B Adhesive sheet for laser dicing and method for manufacturing semiconductor device 电化株式会社 2020-11-06 CN disclosed
US-10008406-B2 Adhesive sheet for laser dicing and method for manufacturing semiconductor device DENKA COMPANY LIMITED (JP) 2018-06-26 US disclosed
US-20170365500-A1 ADHESIVE SHEET FOR LASER DICING AND METHOD FOR MANUFACTURING SEMICONDUCTOR DENKA COMPANY LIMITED (JP) 2017-12-21 US disclosed