⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL19713119 | 0.60 | ALDH1A1 (0.33) | — | |
| SCHEMBL2108758 | 0.60 | — | — | |
| SCHEMBL8855727 | 0.60 | — | — | |
| SCHEMBL1362769 | 0.57 | — | — | |
| SCHEMBL1362457 | 0.57 | — | — | |
| SCHEMBL8567213 | 0.57 | — | — | |
| SCHEMBL19713149 | 0.57 | — | — | |
| SCHEMBL1359924 | 0.57 | — | — | |
| SCHEMBL8566895 | 0.57 | — | — | |
| SCHEMBL8568694 | 0.57 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20180264783-A1 | Metal Foil, Metal Foil Having Release Layer, Laminated Material, Printed Wiring Board, Semiconductor Package, Electronic Device, And Method For Producing Printed Wiring Board | JX NIPPON MINING & METALS CORPORATION (JP) | 2018-09-20 | — | — | US | disclosed |
| US-20170362733-A1 | COPPER FOIL WITH RELEASE LAYER, LAMINATED MATERIAL, METHOD FOR PRODUCING PRINTED WIRING BOARD, AND METHOD FOR PRODUCING ELECTRONIC APPARATUS | JX NIPPON MINING & METALS CORPORATION (JP) | 2017-12-21 | — | — | US | disclosed |