Predicted protein targets (top 17)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | HTR1D | P28221 | 1/20 | 0.52 |
| ▸ | HTR1B | P28222 | 1/20 | 0.52 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.46 |
| ▸ | CYP2D6 | P10635 | 1/20 | 0.46 |
| ▸ | LMNA | P02545 | 1/20 | 0.46 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | SIGMAR1 | Q99720 | 1/20 | 0.45 |
| ▸ | GAA | P10253 | 1/20 | 0.45 |
| ▸ | GFER | P55789 | 1/20 | 0.45 |
| ▸ | BRD4 | O60885 | 1/20 | 0.44 |
| ▸ | MC4R | P32245 | 1/20 | 0.43 |
| ▸ | CRHBP | P24387 | 1/20 | 0.42 |
| ▸ | CRHR2 | Q13324 | 1/20 | 0.42 |
| ▸ | SOS1 | Q07889 | 1/20 | 0.41 |
| ▸ | DDB1 | Q16531 | 1/20 | 0.41 |
| ▸ | CRBN | Q96SW2 | 1/20 | 0.41 |
| ▸ | L3MBTL1 | Q9Y468 | 1/20 | 0.41 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL9447197 | 0.79 | HTR1D (0.57) | HTR1DHTR1BCYP1A2CYP2D6LMNA | |
| SCHEMBL10076926 | 0.78 | CHRNB2 (0.62) | HTR1DHTR1BCYP1A2CYP2D6SIGMAR1 | |
| SCHEMBL10480710 | 0.78 | CYP2D6 (0.46) | HTR1DHTR1BCYP1A2CYP2D6POLB | |
| SCHEMBL7006779 | 0.77 | CHRNA1 (0.69) | LMNAL3MBTL1 | |
| SCHEMBL11135297 | 0.76 | CYP2D6 (0.45) | HTR1DHTR1BCYP1A2CYP2D6POLB | |
| SCHEMBL4102420 | 0.76 | HTR1D (0.55) | HTR1DHTR1BCYP1A2CYP2D6POLB | |
| SCHEMBL11135471 | 0.76 | CYP1A2 (0.71) | HTR1DHTR1BCYP1A2CYP2D6LMNA | |
| Bromide SCHEMBL4392734 | 0.76 | CHRNB2 (0.60) | HTR1DHTR1BCYP1A2CYP2D6SIGMAR1 | |
| SCHEMBL9447081 | 0.76 | HTR1D (0.54) | HTR1DHTR1BCYP1A2CYP2D6SIGMAR1 | |
| SCHEMBL7338988 | 0.75 | HTR1D (0.53) | HTR1DHTR1BCYP1A2CYP2D6POLB |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-0271107-B1 | MOLD CLEANING COMPOSITION, SHEET FOR CLEANING MOLD, AND METHOD FOR CLEANING MOLD USING SAID CLEANING SHEET | NITTO DENKO CORPORATION (JP) | 1993-06-02 | — | — | EP | claimed |
| US-4935175-A | SEMICONDUCTORS; UNCURED RUBBER AND REMOVAL AID OF IMIDAZOLES AND IMIDAZOLINES; CURING | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1990-06-19 | — | — | US | claimed |
| US-12011787-B2 | Flux, solder paste, and electronic circuit board | HARIMA CHEMICALS, INCORPORATED (JP) | 2024-06-18 | — | — | US | disclosed |
| CN-113677814-B | Flux, solder paste, and electronic circuit board | 哈利玛化成株式会社 | 2022-09-13 | — | — | CN | disclosed |
| US-20220193834-A1 | FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD | HARIMA CHEMICALS, INCORPORATED (JP) | 2022-06-23 | — | — | US | disclosed |
| EP-3954796-A1 | FLUX, SOLDER PASTE, AND ELECTRONIC CIRCUIT BOARD | Harima Chemicals, Incorporated (JP) | 2022-02-16 | — | — | EP | disclosed |
| CN-113677814-A | Flux, solder paste, and electronic circuit board | 哈利玛化成株式会社 | 2021-11-19 | — | — | CN | disclosed |
| EP-1813406-B1 | Sheet for regenerating a mold | NITTO DENKO CORP (JP) | 2011-06-22 | — | — | EP | disclosed |
| EP-1813406-A1 | Sheet for regenerating a mold | NITTO DENKO CORPORATION (JP) | 2007-08-01 | — | — | EP | disclosed |
| US-7196199-B2 | Antiserotonine agents; antidepressants | MITSUBISHI PHARMA CORPORATION (JP) | 2007-03-27 | — | — | US | disclosed |
| EP-1188747-B1 | PHENOXYPROPYLAMINE COMPOUNDS | MITSUBISHI PHARMA CORP (JP) | 2005-09-07 | — | — | EP | disclosed |
| US-6077360-A | COMPRISING AN UNVULCANIZED RUBBER, A CLEANING AGENT, AND WATER | NITTO DENKO CORPORATION (JP) | 2000-06-20 | — | — | US | disclosed |
| US-5925605-A | CLEANING AND MOLDING FOR SEMICONDUCTORS USING UNVULCANIZED RUBBER | NITTO DENKO CORPORATION (JP) | 1999-07-20 | — | — | US | disclosed |
| EP-0847843-A1 | Cleaning composition for mold for molding semiconductor device and method of cleaning mold using the same | NITTO DENKO CORPORATION (JP) | 1998-06-17 | — | — | EP | disclosed |
| EP-0271107-B1 | MOLD CLEANING COMPOSITION, SHEET FOR CLEANING MOLD, AND METHOD FOR CLEANING MOLD USING SAID CLEANING SHEET | NITTO DENKO CORPORATION (JP) | 1993-06-02 | — | — | EP | disclosed |
| EP-0272685-B1 | MOLD-RELEASING SHEET AND METHOD FOR APPLYING MOLD-RELEASING AGENT ONTO MOLD SURFACE USING SAID SHEET | NITTO DENKO CORPORATION (JP) | 1992-04-29 | — | — | EP | disclosed |
| US-4956132-A | HEATING, CURING AND PRESSING A COATING OF MOLD RELEASING AGENT TO FORM A UNIFORM LAYER | NITTO DENKO CORPORATION (JP) | 1990-09-11 | — | — | US | disclosed |
| US-4935175-A | SEMICONDUCTORS; UNCURED RUBBER AND REMOVAL AID OF IMIDAZOLES AND IMIDAZOLINES; CURING | NITTO ELECTRIC INDUSTRIAL CO., LTD. (JP) | 1990-06-19 | — | — | US | disclosed |
| EP-0272685-A2 | Mold-releasing sheet and method for applying mold-releasing agent onto mold surface using said sheet | NITTO DENKO CORPORATION (JP) | 1988-06-29 | — | — | EP | disclosed |
| EP-0271107-A2 | Mold cleaning composition, sheet for cleaning mold, and method for cleaning mold using said cleaning sheet | NITTO DENKO CORPORATION (JP) | 1988-06-15 | — | — | EP | disclosed |