SCHEMBL1974532

SCHEMBL1974532

C=CCC(C=C)OP(=O)(O)O

nearest known ligand 0.34

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
LPAR2 Q9HBW0 1/20 0.34
LPAR3 Q9UBY5 1/20 0.34
SMPD1 P17405 3/20 0.31

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL1358739 0.87 LPAR2 (0.31) LPAR2LPAR3
SCHEMBL11315152 0.83
SCHEMBL11160589 0.83
SCHEMBL11309359 0.82
SCHEMBL11312224 0.80
SCHEMBL28960622 0.80 LPAR2 (0.31) LPAR2LPAR3
SCHEMBL4098213 0.80
SCHEMBL29163906 0.80 SMPD1 (0.31) LPAR2LPAR3SMPD1
SCHEMBL11737238 0.79 PPARD (0.37)
SCHEMBL11308534 0.79

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 7 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101681761-B Plasma display panel with improved brightness PANASONIC CORP 2012-12-12 CN disclosed
EP-1367097-B1 CARBON FIBER REINFORCED RESIN COMPOSITION, MOLDING MATERIAL AND MOLDED ARTICLE THEREFROM TORAY INDUSTRIES (JP) 2011-06-22 EP disclosed
CN-101903967-A Plasma display panel PANASONIC CORP 2010-12-01 CN disclosed
CN-101681761-A Plasma display panel with improved brightness PANASONIC CORP 2010-03-24 CN disclosed
US-6998434-B2 Blend of a polymer selected from polyamide, styrenic resin, polyolefin,polycarbonate, polyphenylenesulfide, liquid crystal polymer, phenolic resin and elastomer and conductive carbon fiber for achieving higher conductivity TORAY INDUSTRIES, INC. (JP) 2006-02-14 US disclosed
US-20040077771-A1 Blend of a polymer selected from polyamide, styrenic resin, polyolefin,polycarbonate, polyphenylenesulfide, liquid crystal polymer, phenolic resin and elastomer and conductive carbon fiber for achieving higher conductivity TORAY INDUSTRIES, INC. (JP) 2004-04-22 US disclosed
EP-1367097-A1 CARBON FIBER REINFORCED RESIN COMPOSITION, MOLDING MATERIAL AND MOLDED ARTICLE THEREFROM TORAY INDUSTRIES, INC. (JP) 2003-12-03 EP disclosed