SCHEMBL19756176

SCHEMBL19756176

O=C(OC12CC3CC(C1)C(C(=O)OCC(F)(F)S(=O)(=O)O)C(C3)C2)c1cc(I)cc(I)c1I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19756012 0.83 — —
SCHEMBL19756178 0.82 USP2 (0.30) —
SCHEMBL25476370 0.78 — —
SCHEMBL19756189 0.76 — —
SCHEMBL23065534 0.76 HDAC3 (0.33) —
SCHEMBL20306483 0.76 TSHR (0.31) —
SCHEMBL12369755 0.75 SCN9A (0.34) —
SCHEMBL19756177 0.74 — —
SCHEMBL11964330 0.74 — —
SCHEMBL19756170 0.73 — —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230273519-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD JSR CORPORATION (JP) 2023-08-31 — — US disclosed
US-20170369616-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-12-28 — — US disclosed
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