SCHEMBL19756188

SCHEMBL19756188

O=C(OC1C2OS(=O)(=O)C3C2OC1C3C(=O)OCCS(=O)(=O)O)c1cc(I)cc(I)c1I

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19756185 0.84 — —
SCHEMBL19756038 0.82 — —
SCHEMBL19756186 0.81 — —
SCHEMBL26365360 0.79 — —
SCHEMBL25476386 0.78 — —
SCHEMBL19756191 0.75 HDAC3 (0.32) —
SCHEMBL19756184 0.75 — —
SCHEMBL19756181 0.75 — —
SCHEMBL19756059 0.71 HDAC3 (0.38) —
SCHEMBL19756192 0.71 HDAC3 (0.33) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230273519-A1 RADIATION-SENSITIVE RESIN COMPOSITION AND PATTERN FORMATION METHOD JSR CORPORATION (JP) 2023-08-31 — — US disclosed
US-20170369616-A1 RESIST COMPOSITION AND PATTERNING PROCESS SHIN-ETSU CHEMICAL CO., LTD. (JP) 2017-12-28 — — US disclosed
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