Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 7/20 | 0.41 |
| ▸ | TSHR | P16473 | 4/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.38 |
| ▸ | ENPP2 | Q13822 | 6/20 | 0.36 |
| ▸ | LPAR2 | Q9HBW0 | 3/20 | 0.36 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.35 |
| ▸ | TP53 | P04637 | 3/20 | 0.34 |
| ▸ | CYP3A4 | P08684 | 1/20 | 0.34 |
| ▸ | PKM | P14618 | 2/20 | 0.34 |
| ▸ | GLA | P06280 | 1/20 | 0.33 |
| ▸ | MAPT | P10636 | 2/20 | 0.32 |
| ▸ | HPGD | P15428 | 2/20 | 0.32 |
| ▸ | MEN1 | O00255 | 1/20 | 0.32 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.32 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.32 |
| ▸ | PPARG | P37231 | 1/20 | 0.32 |
| ▸ | HIF1A | Q16665 | 1/20 | 0.32 |
| ▸ | LMNA | P02545 | 1/20 | 0.32 |
| ▸ | GAA | P10253 | 1/20 | 0.32 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21632873 | 0.95 | ALDH1A1 (0.41) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 | |
| SCHEMBL12413467 | 0.92 | TSHR (0.44) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 | |
| SCHEMBL1700640 | 0.85 | TSHR (0.44) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 | |
| SCHEMBL10773587 | 0.80 | ALDH1A1 (0.40) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 | |
| SCHEMBL8082045 | 0.80 | TSHR (0.56) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 | |
| SCHEMBL1981580 | 0.80 | TSHR (0.56) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 | |
| SCHEMBL20101555 | 0.78 | ALDH1A1 (0.31) | ALDH1A1ENPP2LPAR2 | |
| SCHEMBL30301185 | 0.77 | ALDH1A1 (0.38) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 | |
| SCHEMBL1980955 | 0.77 | SMN1; SMN2 (0.47) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 | |
| SCHEMBL30301191 | 0.77 | SMN1; SMN2 (0.47) | ALDH1A1TSHRMAPK1SMN1; SMN2ENPP2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-116722308-A | Functionalized flame-retardant diaphragm, preparation method thereof and application thereof in battery | 中国科学院化学研究所 | 2023-09-08 | — | — | CN | claimed |
| US-20050239975-A1 | Halogen free ignition resistant thermoplastic resin compositions | GAN JOSEPH | 2005-10-27 | — | — | US | claimed |
| EP-1513890-A1 | HALOGEN FREE IGNITION RESISTANT THERMOPLASTIC RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES INC. (US) | 2005-03-16 | — | — | EP | claimed |
| WO-2003102060-A1 | HALOGEN FREE IGNITION RESISTANT THERMOPLASTIC RESIN COMPOSITIONS | DOW GLOBAL TECHNOLOGIES, INC. (US) | 2003-12-11 | — | — | WO | claimed |
| CN-116722308-A | Functionalized flame-retardant diaphragm, preparation method thereof and application thereof in battery | 中国科学院化学研究所 | 2023-09-08 | — | — | CN | disclosed |
| US-10178767-B2 | Resin composition, prepreg, laminate, metallic foil clad laminate, and printed circuit board | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2019-01-08 | — | — | US | disclosed |
| CN-103547626-B | Aluminophosphate as curing inhibitor for epoxy resins | CHEMTURA CORP. (US) | 2016-03-09 | — | — | CN | disclosed |
| EP-2710068-B1 | ALUMINUM PHOSPHORUS ACID SALTS AS EPOXY RESIN CURE INHIBITORS | CHEMTURA CORP (US) | 2015-11-18 | — | — | EP | disclosed |
| US-20150319853-A1 | RESIN COMPOSITION, PREPREG, LAMINATE, METALLIC FOIL CLAD LAMINATE, AND PRINTED CIRCUIT BOARD | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-11-05 | — | — | US | disclosed |
| EP-2927278-A1 | RESIN COMPOSITION, PREPREG, LAMINATED PLATE, METAL FOIL-CLAD LAMINATED PLATE, AND PRINTED CIRCUIT BOARD | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-10-07 | — | — | EP | disclosed |
| US-9145488-B2 | Aluminum phosphorus acid salts as epoxy resin cure inhibitors | CHEMTURA CORPORATION (US) | 2015-09-29 | — | — | US | disclosed |
| US-9006312-B2 | Composite compositions | DOW GLOBAL TECHNOLOGIES LLC (US) | 2015-04-14 | — | — | US | disclosed |
| US-5376453-A | Nonflammable moldings with high glass transition temperature | SIEMENS AKTIENGESELLSCHAFT (DE) | 1994-12-27 | — | — | US | disclosed |
| US-5364893-A | Hydrogenated aromatic diisocyanate trimer curing agent | SIEMENS AKTIENGESELLSCHAFT (DE) | 1994-11-15 | — | — | US | disclosed |
| EP-0384939-B1 | Epoxy resin moulding compositions | SIEMENS AG (DE) | 1994-06-22 | — | — | EP | disclosed |
| EP-0384940-B1 | Epoxy resin compositions | SIEMENS AG (DE) | 1994-06-22 | — | — | EP | disclosed |
| US-5036135-A | Comprising a phosphorus-free diepoxide, an epoxy-group-contai ning phosphorus compound, a diisocyanate, a curing catalyst an d filler; nonflammable molding materials | SIEMENS AKTIENGESELLSCHAFT (DE) | 1991-07-30 | — | — | US | disclosed |
| EP-0408990-A2 | Thermosetting reaction resin mixture | SIEMENS AKTIENGESELLSCHAFT (DE) | 1991-01-23 | — | — | EP | disclosed |
| EP-0384940-A1 | Epoxy resin compositions | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-09-05 | — | — | EP | disclosed |
| EP-0384939-A1 | Epoxy resin moulding compositions | SIEMENS AKTIENGESELLSCHAFT (DE) | 1990-09-05 | — | — | EP | disclosed |