SCHEMBL19809367

SCHEMBL19809367

CCO[Si](C)(OCC)C(O)c1ccccc1

nearest known ligand 0.45

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
LMNA P02545 2/20 0.45
POLB P06746 1/20 0.43
HTT P42858 1/20 0.39
MEN1 O00255 2/20 0.38
KMT2A Q03164 2/20 0.38
TAAR1 Q96RJ0 1/20 0.38
MMP8 P22894 1/20 0.37
ALDH1A1 P00352 2/20 0.36
MAPK1 P28482 2/20 0.36
L3MBTL1 Q9Y468 2/20 0.36
HPGD P15428 1/20 0.36
ALOX15 P16050 1/20 0.36
TSHR P16473 1/20 0.36
NPSR1 Q6W5P4 1/20 0.36
KDM4E B2RXH2 4/20 0.36
AOC3 Q16853 2/20 0.36
MAPT P10636 1/20 0.36
ADRA2A P08913 1/20 0.35
ADRA2C P18825 1/20 0.35
HIF1A Q16665 1/20 0.35

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19809272 0.93 LMNA (0.42) LMNAPOLBMEN1KMT2ATAAR1
SCHEMBL19809271 0.92 LMNA (0.39) LMNAPOLBHTTMEN1KMT2A
SCHEMBL19809243 0.85 LMNA (0.42) LMNAPOLBHTTALDH1A1MAPK1
SCHEMBL19809281 0.82 LMNA (0.47) LMNAPOLBHTTMMP8MAPK1
SCHEMBL19809305 0.82 LMNA (0.47) LMNAPOLBHTTMMP8MAPK1
SCHEMBL29415898 0.81 LMNA (0.46) LMNAHTTKMT2AALDH1A1MAPK1
SCHEMBL19809248 0.79 LMNA (0.44) LMNAPOLBHTTMMP8MAPK1
SCHEMBL7938711 0.78 TAAR1 (0.38) LMNAPOLBHTTTAAR1MMP8
SCHEMBL21175528 0.78 LMNA (0.42) LMNAPOLBKMT2AMMP8ALDH1A1
SCHEMBL19809462 0.78 KMT2A (0.41) LMNAMEN1KMT2AALDH1A1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 33 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11912889-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2024-02-27 US disclosed
US-20230257503-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE MITSUBISHI CHEMICAL CORPORATION (JP) 2023-08-17 US disclosed
EP-4212256-A1 RESIN COMPOSITION, CURED PRODUCT AND MANUFACTURING METHOD THEREFOR, AND LAMINATE Mitsubishi Chemical Corporation (JP) 2023-07-19 EP disclosed
CN-116075368-A Resin composition, cured product, method for producing same, and laminate 三菱化学株式会社 2023-05-05 CN disclosed
US-11542397-B2 Liquid composition, quantum dot-containing film, optical film, light-emitting display element panel, and light-emitting display device TOKYO OHKA KOGYO CO., LTD. (JP) 2023-01-03 US disclosed
US-11413682-B2 Method for producing surface-modified metal oxide fine particle, method for producing improved metal oxide fine particles, surface-modified metal oxide fine particles, and metal oxide fine particle dispersion liquid TOKYO OHKA KOGYO CO., LTD. (JP) 2022-08-16 US disclosed
CN-110249004-B Polyimide precursor composition 东京应化工业株式会社 2022-07-19 CN disclosed
US-20220220338-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR FORMING SILICON-CONTAINING POLYMER COATING, METHOD FOR FORMING SILICA COATING, AND PRODUCTION METHOD FOR SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-14 US disclosed
US-20220213348-A1 SILICON-CONTAINING POLYMER, FILM-FORMING COMPOSITION, METHOD FOR SUPPORTING METAL COMPOUND ON SURFACE OF OBJECT TO BE TREATED, ARTICLE HAVING METAL COMPOUND-SUPPORTING COATING FILM, AND METHOD FOR PRODUCING SILICON-CONTAINING POLYMER TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-07 US disclosed
US-11377522-B2 Silicon-containing polymer, film-forming composition, method for forming silicon-containing polymer coating, method for forming silica-based coating, and production method for silicon-containing polymer TOKYO OHKA KOGYO CO., LTD. (JP) 2022-07-05 US disclosed
US-20200139433-A1 METHOD FOR PRODUCING SURFACE-MODIFIED METAL OXIDE FINE PARTICLE, METHOD FOR PRODUCING IMPROVED METAL OXIDE FINE PARTICLES, SURFACE-MODIFIED METAL OXIDE FINE PARTICLES, AND METAL OXIDE FINE PARTICLE DISPERSION LIQUID TOKYO OHKA KOGYO CO., LTD. (JP) 2020-05-07 US disclosed
EP-3318606-B1 SILICON-CONTAINING RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2020-03-18 EP disclosed
EP-3275940-B1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-12-18 EP disclosed
US-20190225804-A1 ENERGY-SENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2019-07-25 US disclosed
EP-3330320-B1 POLYIMIDE PRECURSOR COMPOSITION TOKYO OHKA KOGYO CO LTD (JP) 2019-04-24 EP disclosed
US-20180223045-A1 POLYIMIDE PRECURSOR COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-08-09 US disclosed
US-20180187010-A1 SILICON-CONTAINING RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-07-05 US disclosed
EP-3330320-A1 POLYIMIDE PRECURSOR COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-06-06 EP disclosed
EP-3318606-A1 SILICON-CONTAINING RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-05-09 EP disclosed
EP-3275940-A1 ENERGY-SENSITIVE RESIN COMPOSITION Tokyo Ohka Kogyo Co., Ltd. (JP) 2018-01-31 EP disclosed

Patent text — is the patent's own abstract consistent with the prediction?

For each of this compound's patents that has machine-readable text (1 of them — usually the abstract, not the full specification), we ask MedCPT which protein the text reads most about, and where the chemistry-predicted target lands among 4885 human targets. A high rank means the patent's own wording is consistent with the prediction — a weak, independent signal, not proof of activity.

PatentTitleText reads most aboutPredicted target · text-rank
US-20180187010-A1 SILICON-CONTAINING RESIN COMPOSITION CROCC, SRI, SEM1 LMNA 2252/4885POLB 828/4885HTT 1557/4885

“Text reads most about” is the patent abstract's nearest protein in MedCPT space (background-debiased). Only ~1.4% of patents have machine-readable text, so most compounds won't have this panel.