SCHEMBL19809596

SCHEMBL19809596

O=P(O)(c1ccccc1)c1ccccc1.O=P(O)(c1ccccc1)c1ccccc1.[Zn]

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
CA2 P00918 1/20 0.65
CA4 P22748 1/20 0.65
CA5A P35218 1/20 0.65
CFTR P13569 1/20 0.56
TSHR P16473 2/20 0.52
LMNA P02545 1/20 0.52
ALOX15 P16050 1/20 0.52
ALDH1A1 P00352 3/20 0.50
MEN1 O00255 1/20 0.50
KMT2A Q03164 1/20 0.50
ESR1 P03372 2/20 0.48
ESR2 Q92731 1/20 0.48
GAA P10253 2/20 0.46
USP2 O75604 1/20 0.46
CYP1A2 P05177 1/20 0.45
CYP3A4 P08684 1/20 0.45
CYP2C9 P11712 1/20 0.45
CYP2C19 P33261 1/20 0.45
SRC P12931 2/20 0.44
PTPN1 P18031 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL190617 1.00 CA2 (0.65) CA2CA4CA5ACFTRTSHR
SCHEMBL191567 0.97 CA2 (0.68) CA2CA4CA5ACFTRTSHR
Hydrochloric Acid SCHEMBL2361106 0.94 CA2 (0.65) CA2CA4CA5ACFTRTSHR
SCHEMBL226388 0.94 CA2 (0.65) CA2CA4CA5ACFTRTSHR
SCHEMBL19895693 0.94 CA2 (0.65) CA2CA4CA5ACFTRTSHR
SCHEMBL19809604 0.94 CA2 (0.65) CA2CA4CA5ACFTRTSHR
SCHEMBL672826 0.94 CA2 (0.65) CA2CA4CA5ACFTRTSHR
SCHEMBL19809603 0.94 CA2 (0.65) CA2CA4CA5ACFTRTSHR
SCHEMBL191417 0.94 CA2 (0.65) CA2CA4CA5ACFTRTSHR
SCHEMBL190541 0.94 CA2 (0.65) CA2CA4CA5ACFTRTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 13 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-112485968-B Photosensitive resin composition, dry film, and printed wiring board having photocurable substance of photosensitive resin composition 株式会社田村制作所 2025-03-11 CN disclosed
CN-118707805-A Photosensitive resin composition, cured product, and printed wiring board 株式会社田村制作所 2024-09-27 CN disclosed
CN-117043675-A Photosensitive resin composition 株式会社田村制作所 2023-11-10 CN disclosed
US-10655005-B2 Epoxy resin composition ADEKA CORPORATION (JP) 2020-05-19 US disclosed
CN-110461592-A The metal component and wiring plate of metal-clad laminate, resin PANASONIC IP MAN CO LTD 2019-11-15 CN disclosed
CN-110297392-A Photosensitive polymer combination 株式会社田村制作所 2019-10-01 CN disclosed
CN-110095938-A Photosensitive polymer combination 株式会社田村制作所 2019-08-06 CN disclosed
CN-108693709-A Photosensitive polymer combination 株式会社田村制作所 2018-10-23 CN disclosed
CN-108628093-A Photosensitive polymer combination 株式会社田村制作所 2018-10-09 CN disclosed
CN-108628096-A Black-colored photosensitive resin composition 株式会社田村制作所 2018-10-09 CN disclosed
CN-108300143-A Hardening resin composition 株式会社田村制作所 2018-07-20 CN disclosed
US-20180051167-A1 EPOXY RESIN COMPOSITION ADEKA CORPORATION (JP) 2018-02-22 US disclosed
EP-3275935-A1 EPOXY RESIN COMPOSITION Adeka Corporation (JP) 2018-01-31 EP disclosed