⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL28950 | 0.97 | — | — | |
| SCHEMBL28188291 | 0.93 | — | — | |
| SCHEMBL9309058 | 0.93 | — | — | |
| SCHEMBL9438163 | 0.93 | — | — | |
| SCHEMBL9113124 | 0.93 | — | — | |
| Sulfuric Acid SCHEMBL3390874 | 0.93 | CA5A (0.40) | — | |
| SCHEMBL27541517 | 0.93 | — | — | |
| Ammonia Solution, Strong SCHEMBL6544918 | 0.93 | — | — | |
| Hydrochloric Acid SCHEMBL28213776 | 0.90 | — | — | |
| Nitrogen SCHEMBL27953045 | 0.90 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 35 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-118080013-A | Double-atom catalyst loaded by metal organic framework material and preparation and application thereof | 中国科学院大连化学物理研究所 | 2024-05-28 | — | — | CN | claimed |
| CN-115787010-A | Black ruthenium plating solution and application thereof in preparation of pseudo-classic gold or platinum and other ornaments | 周大福珠宝文化产业园(武汉)有限公司 | 2023-03-14 | — | — | CN | claimed |
| CN-111032911-B | Selective electroless electrochemical atomic layer deposition in aqueous solution without external voltage bias | 朗姆研究公司 | 2023-03-14 | — | — | CN | claimed |
| US-10640874-B2 | Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias | LAM RESEARCH CORPORATION (US) | 2020-05-05 | — | — | US | claimed |
| CN-111032911-A | Selective electroless electrochemical atomic layer deposition in aqueous solution without external voltage bias | 朗姆研究公司 | 2020-04-17 | — | — | CN | claimed |
| US-20190048472-A1 | SELECTIVE ELECTROLESS ELECTROCHEMICAL ATOMIC LAYER DEPOSITION IN AN AQUEOUS SOLUTION WITHOUT EXTERNAL VOLTAGE BIAS | LAM RESEARCH CORPORATION | 2019-02-14 | — | — | US | claimed |
| CN-104450864-A | Composition and application thereof | SINOCARE INC | 2015-03-25 | — | — | CN | claimed |
| JP-2006518665-A | — | — | 2006-08-17 | — | — | JP | claimed |
| US-20060073966-A1 | Electrocatalysts and processes for producing | E. I. DU PONT DE NEMOURS AND COMPANY | 2006-04-06 | — | — | US | claimed |
| WO-2004073090-A2 | ELECTROCATALYSTS AND PROCESSES FOR PRODUCING | E.I. DU PONT DE NEMOURS AND COMPANY (US) | 2004-08-26 | — | — | WO | claimed |
| CN-115787010-B | Black ruthenium plating solution and application thereof in preparation of antique gold or platinum ornaments | 周大福珠宝文化产业园(武汉)有限公司 | 2024-11-12 | — | — | CN | disclosed |
| CN-118080013-A | Double-atom catalyst loaded by metal organic framework material and preparation and application thereof | 中国科学院大连化学物理研究所 | 2024-05-28 | — | — | CN | disclosed |
| CN-115787010-A | Black ruthenium plating solution and application thereof in preparation of pseudo-classic gold or platinum and other ornaments | 周大福珠宝文化产业园(武汉)有限公司 | 2023-03-14 | — | — | CN | disclosed |
| CN-111032911-B | Selective electroless electrochemical atomic layer deposition in aqueous solution without external voltage bias | 朗姆研究公司 | 2023-03-14 | — | — | CN | disclosed |
| US-10640874-B2 | Selective electroless electrochemical atomic layer deposition in an aqueous solution without external voltage bias | LAM RESEARCH CORPORATION (US) | 2020-05-05 | — | — | US | disclosed |
| EP-1846947-A1 | GATE STACK ENGINEERING BY ELECTROCHEMICAL PROCESSING UTILIZING THROUGH-GATE-DIELECTRIC CURRENT FLOW | International Business Machines Corporation (US) | 2007-10-24 | — | — | EP | disclosed |
| WO-2007112361-A2 | STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-10-04 | — | — | WO | disclosed |
| US-20070222066-A1 | STRUCTURE AND METHOD OF FORMING ELECTRODEPOSITED CONTACTS | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2007-09-27 | — | — | US | disclosed |
| WO-2006080980-A1 | GATE STACK ENGINEERING BY ELECTROCHEMICAL PROCESSING UTILIZING THROUGH-GATE-DIELECTRIC CURRENT FLOW | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-08-03 | — | — | WO | disclosed |
| US-20060166474-A1 | Gate stack engineering by electrochemical processing utilizing through-gate-dielectric current flow | INTERNATIONAL BUSINESS MACHINES CORPORATION (US) | 2006-07-27 | — | — | US | disclosed |