Predicted protein targets (top 2)
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL4809036 | 0.95 | PTGS1 (0.31) | PTGS1PTGS2 | |
| SCHEMBL4809106 | 0.92 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL23202578 | 0.90 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL1997386 | 0.84 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL4810417 | 0.83 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL384457 | 0.83 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL5821286 | 0.82 | PTGS1 (0.33) | PTGS1PTGS2 | |
| SCHEMBL18021909 | 0.81 | PTGS1 (0.36) | PTGS1PTGS2 | |
| SCHEMBL4808802 | 0.80 | PTGS1 (0.30) | PTGS1PTGS2 | |
| SCHEMBL4809111 | 0.79 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 26 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20240158904-A1 | UNDERCOAT AGENT COMPOSITION FOR LAYERING INORGANIC MATERIAL LAYER, CURED PRODUCT THEREOF AND PRODUCTION METHOD THEREOF | TOAGOSEI CO., LTD. (JP) | 2024-05-16 | — | — | US | disclosed |
| EP-4289618-A1 | UNDERCOAT AGENT COMPOSITION FOR INORGANIC SUBSTANCE LAYER LAMINATION, CURED PRODUCT THEREOF, AND METHOD FOR PRODUCING SAME | Toagosei Co., Ltd. (JP) | 2023-12-13 | — | — | EP | disclosed |
| CN-116897195-A | Primer composition for inorganic substance layer lamination, cured product thereof, and method for producing same | 东亚合成株式会社 | 2023-10-17 | — | — | CN | disclosed |
| WO-2023171514-A1 | LAMINATE AND PACKAGING MATERIAL | DIC株式会社 | 2023-09-14 | — | — | WO | disclosed |
| EP-3213915-B1 | LAMINATE | DAINIPPON INK & CHEMICALS (JP) | 2019-08-14 | — | — | EP | disclosed |
| EP-2803699-B1 | RUBBER COMPOSITION FOR TIRE, VULCANIZED RUBBER COMPOSITION FOR TIRE, AND TIRES USING SAME | BRIDGESTONE CORP (JP) | 2018-09-12 | — | — | EP | disclosed |
| US-20170253965-A1 | LAMINATE | DIC CORPORATION (JP) | 2017-09-07 | — | — | US | disclosed |
| EP-3213915-A1 | LAMINATE | DIC Corporation (JP) | 2017-09-06 | — | — | EP | disclosed |
| US-9623705-B2 | Method for producing modified conjugated diene polymer/copolymer, modified conjugated diene polymer/copolymer, and rubber composition and tire using the same | BRIDGESTONE CORPORATION (JP) | 2017-04-18 | — | — | US | disclosed |
| US-9447208-B2 | Rubber composition for tire, vulcanized rubber composition for tire, and tires using same | BRIDGESTONE CORPORATION (JP) | 2016-09-20 | — | — | US | disclosed |
| EP-2266819-A1 | METHOD FOR PRODUCING MODIFIED CONJUGATED DIENE POLYMER/COPOLYMER, MODIFIED CONJUGATED DIENE POLYMER/COPOLYMER, AND RUBBER COMPOSITION AND TIER USING THE SAME | Bridgestone Corporation (JP) | 2010-12-29 | — | — | EP | disclosed |
| US-20100171414-A1 | SEALING AGENT FOR OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR ELEMENT | SEKISUI CHEMICAL CO., LTD. (JP) | 2010-07-08 | — | — | US | disclosed |
| EP-2159242-A1 | SEALING AGENT FOR OPTICAL SEMICONDUCTOR ELEMENT, AND OPTICAL SEMICONDUCTOR ELEMENT | Sekisui Chemical Co., Ltd. (JP) | 2010-03-03 | — | — | EP | disclosed |
| US-7435668-B2 | Method for doping impurities, and for producing a semiconductor device and applied electronic apparatus using a solution containing impurity ions | SONY CORPORATION (JP) | 2008-10-14 | — | — | US | disclosed |
| US-7335539-B2 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2008-02-26 | — | — | US | disclosed |
| US-20070298550-A1 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2007-12-27 | — | — | US | disclosed |
| US-7273774-B2 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2007-09-25 | — | — | US | disclosed |
| US-20060079033-A1 | Method for making thin-film semiconductor device | SONY CORPORATION (JP) | 2006-04-13 | — | — | US | disclosed |
| US-20050181566-A1 | Method for doping impurities, methods for producing semiconductor device and applied electronic apparatus | SONY CORPORATION (JP) | 2005-08-18 | — | — | US | disclosed |
| US-5093389-A | Epoxy-Terminated Polysiloxane, Silanol-Terminated Polysiloxane Aminoxysilicon Compound | TOSHIBA SILICONE CO., LTD. (JP) | 1992-03-03 | — | — | US | disclosed |