⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL21534518 | 0.79 | ALDH1A1 (0.32) | — | |
| SCHEMBL19139267 | 0.75 | ALDH1A1 (0.32) | — | |
| SCHEMBL18866673 | 0.73 | ALDH1A1 (0.30) | — | |
| SCHEMBL18625133 | 0.73 | ALDH1A1 (0.30) | — | |
| SCHEMBL23690185 | 0.71 | — | — | |
| SCHEMBL8516858 | 0.71 | — | — | |
| SCHEMBL18655734 | 0.69 | — | — | |
| SCHEMBL18386569 | 0.67 | — | — | |
| SCHEMBL25901205 | 0.67 | — | — | |
| SCHEMBL21646735 | 0.66 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 5 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| WO-2023162989-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, RESIN FILM, LAMINATED BOARD, PRINTED WIRING BOARD, AND SEMICONDUCTOR PACKAGE | 株式会社レゾナック | 2023-08-31 | — | — | WO | disclosed |
| WO-2020040187-A1 | RESIN COMPOSITION, PREPREG, LAMINATED BOARD, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND METHOD FOR PRODUCING MULTILAYER PRINTED WIRING BOARD | 日立化成株式会社 | 2020-02-27 | — | — | WO | disclosed |
| WO-2019172342-A1 | PREPREG, LAYERED PLATE, MULTILAYER PRINTED WIRING BOARD, SEMICONDUCTOR PACKAGE, AND RESIN COMPOSITION, AND METHOD OF MANUFACTURING PREPREG, LAYERED PLATE, AND MULTILAYER PRINTED WIRING BOARD | 日立化成株式会社 | 2019-09-12 | — | — | WO | disclosed |
| EP-3290479-A1 | THERMOSETTING RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD | Hitachi Chemical Co., Ltd. (JP) | 2018-03-07 | — | — | EP | disclosed |
| EP-3290480-A1 | RESIN COMPOSITION, PREPREG, LAMINATE AND MULTILAYER PRINTED WIRING BOARD | Hitachi Chemical Company, Ltd. (JP) | 2018-03-07 | — | — | EP | disclosed |