Predicted protein targets (top 16)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 1/20 | 0.48 |
| ▸ | ALDH1A1 | P00352 | 5/20 | 0.45 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.45 |
| ▸ | HSD17B10 | Q99714 | 2/20 | 0.45 |
| ▸ | HPGD | P15428 | 3/20 | 0.44 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.44 |
| ▸ | FABP1 | P07148 | 1/20 | 0.43 |
| ▸ | PGR | P06401 | 1/20 | 0.43 |
| ▸ | GAA | P10253 | 1/20 | 0.43 |
| ▸ | PTGS1 | P23219 | 1/20 | 0.43 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.43 |
| ▸ | SLC22A6 | Q4U2R8 | 1/20 | 0.43 |
| ▸ | HTR1B | P28222 | 4/20 | 0.41 |
| ▸ | SLC6A4 | P31645 | 1/20 | 0.41 |
| ▸ | OGG1 | O15527 | 1/20 | 0.40 |
| ▸ | HTR1D | P28221 | 1/20 | 0.40 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethylamine SCHEMBL28014652 | 0.89 | HTR1B (0.47) | TSHRALDH1A1KDM4EHSD17B10HPGD | |
| SCHEMBL275479 | 0.88 | SLC22A6 (0.51) | TSHRALDH1A1KDM4EHSD17B10HPGD | |
| Water SCHEMBL2147729 | 0.87 | FABP1 (0.50) | TSHRALDH1A1KDM4EHSD17B10HPGD | |
| Ammonia Solution, Strong SCHEMBL10605012 | 0.87 | FABP1 (0.50) | TSHRALDH1A1KDM4EHSD17B10HPGD | |
| Ether SCHEMBL11474697 | 0.84 | TSHR (0.44) | TSHRALDH1A1KDM4EHSD17B10HPGD | |
| SCHEMBL4484229 | 0.78 | TSHR (0.46) | TSHRALDH1A1KDM4EHSD17B10HPGD | |
| Ether SCHEMBL21694714 | 0.78 | TSHR (0.49) | TSHRALDH1A1KDM4EHSD17B10HTR1B | |
| SCHEMBL11408937 | 0.78 | TSHR (0.47) | TSHRALDH1A1KDM4EHSD17B10HPGD | |
| SCHEMBL10647420 | 0.77 | SLC22A6 (0.53) | ALDH1A1KDM4EHSD17B10HPGDTDP1 | |
| Ether SCHEMBL5028460 | 0.76 | MAPT (0.50) | TSHRALDH1A1KDM4EHSD17B10HTR1B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| CN-106634417-B | Industrial legacy steel structure surface layer protective agent and preparation method and application thereof | 中国京冶工程技术有限公司 | 2020-06-09 | — | — | CN | claimed |
| CN-106675324-B | Industrial legacy steel structure intermediate layer connecting agent and preparation method and application thereof | 中国京冶工程技术有限公司 | 2020-04-21 | — | — | CN | claimed |
| CN-119604654-A | Sizing agent for fibers and use thereof | 松本油脂制药株式会社 | 2025-03-11 | — | — | CN | disclosed |
| CN-106634417-B | Industrial legacy steel structure surface layer protective agent and preparation method and application thereof | 中国京冶工程技术有限公司 | 2020-06-09 | — | — | CN | disclosed |
| CN-106700825-B | Long-acting comprehensive protection method for industrial legacy steel structure | 中国京冶工程技术有限公司 | 2020-06-09 | — | — | CN | disclosed |
| CN-106675324-B | Industrial legacy steel structure intermediate layer connecting agent and preparation method and application thereof | 中国京冶工程技术有限公司 | 2020-04-21 | — | — | CN | disclosed |
| CN-106752694-B | Protective agent for steel structure base layer of industrial heritage and preparation method and application thereof | 中国京冶工程技术有限公司 | 2020-04-21 | — | — | CN | disclosed |
| CN-106634417-A | Industrial heritage structural structure surface layer protection agent, as well as preparation method and application thereof | 中国京冶工程技术有限公司 | 2017-05-10 | — | — | CN | disclosed |
| CN-106189641-A | A kind of preparation method of the aqueous epoxy resins anti-flaming dope being applied to circuit board | 关亚玲 | 2016-12-07 | — | — | CN | disclosed |
| CN-106085123-A | A kind of aqueous epoxy resin emulsion, the water-thinned epoxy zinc-rich coating and preparation method thereof of railway bearing | 成都拜迪新材料有限公司 | 2016-11-09 | — | — | CN | disclosed |
| CN-105860906-A | Conductive adhesive for LED (light-emitting diode) chip bonding | 李康 | 2016-08-17 | — | — | CN | disclosed |
| US-20110146516-A1 | METHOD OF PREPARING LITHOGRAPHIC PRINTING PLATE | FUJIFILM CORPORATION (JP) | 2011-06-23 | — | — | US | disclosed |