SCHEMBL19971742

SCHEMBL19971742

O=C1C=CC(=O)N1CC(C(CN1C(=O)C=CC1=O)N1C(=O)C=CC1=O)N1C(=O)C=CC1=O

nearest known ligand 0.44

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
MGLL Q99685 10/20 0.44
FAAH O00519 4/20 0.44
ALDH1A1 P00352 3/20 0.44
LMNA P02545 2/20 0.44
MAPT P10636 2/20 0.44
NPSR1 Q6W5P4 2/20 0.44
BLM P54132 2/20 0.44
GMNN O75496 1/20 0.44
THPO P40225 1/20 0.44
PMP22 Q01453 1/20 0.44
HPGD P15428 2/20 0.42
HSP90AA1 P07900 1/20 0.42
TLR9 Q9NR96 1/20 0.42
TP53 P04637 1/20 0.42
PKM P14618 1/20 0.42
XBP1 P17861 1/20 0.42
MAPK1 P28482 1/20 0.42
HTT P42858 1/20 0.42
RECQL P46063 1/20 0.42
RAB9A P51151 1/20 0.42

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL44138 0.77 MGLL (0.46) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL8168349 0.76 MGLL (0.46) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL12930410 0.76 MGLL (0.50) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL25246820 0.72 MGLL (0.46) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL709030 0.72 MGLL (0.46) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL153302 0.72 MGLL (0.52) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL11927409 0.72 MGLL (0.46) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL31071892 0.70 MGLL (0.35) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL19696282 0.70 MGLL (0.40) MGLLFAAHALDH1A1LMNAMAPT
SCHEMBL28787286 0.70 MGLL (0.45) MGLLFAAHALDH1A1LMNAMAPT

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3279261-B1 RESIN COMPOSITION, ELECTROCONDUCTIVE RESIN COMPOSITION, ADHESIVE, ELECTROCONDUCTIVE ADHESIVE, PASTE FOR FORMING ELECTRODES, AND SEMICONDUCTOR DEVICE NAMICS CORP (JP) 2023-11-01 EP disclosed
US-10294324-B2 Resin composition, conductive resin composition, adhesive, conductive adhesive, paste for forming electrodes, and semiconductor device NAMICS CORPORATION (JP) 2019-05-21 US disclosed
US-20180079856-A1 RESIN COMPOSITION, CONDUCTIVE RESIN CONPOSITION, ADHESIVE, CONDUCTIVE ADHESIVE, PASTE FOR FORMING ELECTRODES, AND SEMICONDUCTOR DEVICE NAMICS CORPORATION (JP) 2018-03-22 US disclosed