⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL17343183 | 0.87 | — | — | |
| SCHEMBL1531435 | 0.81 | — | — | |
| SCHEMBL20451235 | 0.81 | — | — | |
| SCHEMBL10702470 | 0.77 | — | — | |
| SCHEMBL15025950 | 0.74 | — | — | |
| SCHEMBL20254150 | 0.73 | CYP2C19 (0.33) | — | |
| SCHEMBL29277053 | 0.72 | — | — | |
| SCHEMBL20451251 | 0.72 | — | — | |
| SCHEMBL20451243 | 0.72 | — | — | |
| SCHEMBL12695255 | 0.69 | DNM1 (0.30) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| EP-3516089-A1 | COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS | Versum Materials US, LLC (US) | 2019-07-31 | — | — | EP | claimed |
| WO-2018053129-A1 | COMPOSITIONS AND METHODS FOR THE DEPOSITION OF SILICON OXIDE FILMS | VERSUM MATERIALS US, LLC (US) | 2018-03-22 | — | — | WO | claimed |
| US-12435416-B2 | Compositions and methods using same for non-conformal deposition of silicon containing films | VERSUM MATERIALS US, LLC (US) | 2025-10-07 | — | — | US | disclosed |
| US-20250188609-A1 | SEAM-FREE AND CRACK-FREE DEPOSITION | LAM RES CORP (US) | 2025-06-12 | — | — | US | disclosed |
| CN-114867888-B | Method for depositing film | 弗萨姆材料美国有限责任公司 | 2025-05-30 | — | — | CN | disclosed |
| US-20250054747-A1 | CONFORMAL DEPOSITION OF SILICON NITRIDE | LAM RES CORP (US) | 2025-02-13 | — | — | US | disclosed |
| US-20250038003-A1 | LOW TEMPERATURE MOLYBDENUM DEPOSITION ASSISTED BY SILICON-CONTAINING REACTANTS | LAM RESEARCH CORPORATION (US) | 2025-01-30 | — | — | US | disclosed |
| US-20250014890-A1 | CONFORMAL, CARBON-DOPED SILICON NITRIDE FILMS AND METHODS THEREOF | LAM RESEARCH CORPORATION | 2025-01-09 | — | — | US | disclosed |
| CN-119213529-A | Seamless and crack-free deposition | 朗姆研究公司 | 2024-12-27 | — | — | CN | disclosed |
| WO-2024243002-A1 | LOW PRESSURE CHEMICAL VAPOR DEPOSITION OF SILICON OXIDE | LAM RESEARCH CORPORATION (US) | 2024-11-28 | — | — | WO | disclosed |
| EP-4065746-B1 | METHOD FOR DEPOSITING A FILM | VERSUM MAT US LLC (US) | 2024-09-04 | — | — | EP | disclosed |
| US-20230058258-A1 | METHOD FOR DEPOSITING A FILM | VERSUM MATERIALS US, LLC (US) | 2023-02-23 | — | — | US | disclosed |
| WO-2022221881-A1 | INTEGRATION OF FULLY ALIGNED VIA THROUGH SELECTIVE DEPOSITION AND RESISTIVITY REDUCTION | LAM RESEARCH CORPORATION (US) | 2022-10-20 | — | — | WO | disclosed |
| US-20220333241-A1 | COMPOSITIONS AND METHODS USING SAME FOR NON-CONFORMAL DEPOSITION OF SILICON CONTAINING FILMS | VERSUM MATERIALS US, LLC (US) | 2022-10-20 | — | — | US | disclosed |
| EP-4065746-A1 | METHOD FOR DEPOSITING A FILM | Versum Materials US, LLC (US) | 2022-10-05 | — | — | EP | disclosed |
| CN-114867888-A | Method for depositing a film | 弗萨姆材料美国有限责任公司 | 2022-08-05 | — | — | CN | disclosed |
| EP-4013903-A1 | COMPOSITIONS AND METHODS USING SAME FOR NON-CONFORMAL DEPOSITION OF SILICON-CONTAINING FILMS | Versum Materials US, LLC (US) | 2022-06-22 | — | — | EP | disclosed |
| CN-114365265-A | Compositions for non-conformal deposition of silicon-containing films and methods of using the same | 弗萨姆材料美国有限责任公司 | 2022-04-15 | — | — | CN | disclosed |
| WO-2021133774-A1 | METHOD FOR DEPOSITING A FILM | VERSUM MATERIALS US, LLC (US) | 2021-07-01 | — | — | WO | disclosed |
| WO-2021050368-A1 | COMPOSITIONS AND METHODS USING SAME FOR NON-CONFORMAL DEPOSITION OF SILICON-CONTAINING FILMS | VERSUM MATERIALS US, LLC (US) | 2021-03-18 | — | — | WO | disclosed |