SCHEMBL1997388

SCHEMBL1997388

CCCS(=O)(=O)OC1CCCCC1

nearest known ligand 0.48

Predicted protein targets (top 17)

geneUniProtsupporting neighboursconfidence
CA1 P00915 2/20 0.48
CA2 P00918 2/20 0.48
ENPP3 O14638 1/20 0.39
ENPP1 P22413 1/20 0.39
ENPP2 Q13822 1/20 0.39
NAAA Q02083 2/20 0.37
EPHX1 P07099 1/20 0.36
KMT2A Q03164 1/20 0.31
CYP1A2 P05177 1/20 0.31
CA12 O43570 1/20 0.31
CA7 P43166 1/20 0.31
CA13 Q8N1Q1 1/20 0.31
ACHE P22303 1/20 0.31
MMP2 P08253 1/20 0.30
MMP7 P09237 1/20 0.30
MMP9 P14780 1/20 0.30
MMP14 P50281 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL14779950 0.98 CA1 (0.45) CA1CA2ENPP3ENPP1ENPP2
SCHEMBL28507064 0.94 CA1 (0.40) CA1CA2ENPP3ENPP1ENPP2
SCHEMBL14779498 0.88 CA1 (0.45) CA1CA2ENPP3ENPP1ENPP2
SCHEMBL14778290 0.87 CA1 (0.56) CA1CA2EPHX1CA12CA7
SCHEMBL14779438 0.87 CA1 (0.56) CA1CA2EPHX1CA12CA7
SCHEMBL14778040 0.86 NAAA (0.45) CA1CA2NAAAEPHX1CYP1A2
SCHEMBL14778327 0.86 CA1 (0.42) CA1CA2NAAAEPHX1CYP1A2
SCHEMBL2143661 0.85 NAAA (0.47) CA1CA2NAAAEPHX1CYP1A2
SCHEMBL14779125 0.85 NAAA (0.47) CA1CA2NAAAEPHX1CYP1A2
SCHEMBL1994340 0.85 NAAA (0.47) CA1CA2NAAAEPHX1CYP1A2

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 28 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
CN-101967221-B Cleanable waterborne polyurethane coatings BAYER MATERIALSCIENCE LLC 2014-07-09 CN claimed
CN-1306336-C Photoresist composite and pattern forming process with it SAMSUNG ELECTRONICS CO LTD (KR) 2007-03-21 CN claimed
CN-1432871-A Photoresist composite and pattern forming process with it SAMSUNG ELECTRONICS CO LTD (KR) 2003-07-30 CN claimed
US-9851639-B2 Photoacid generating polymers containing a urethane linkage for lithography INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2017-12-26 US disclosed
WO-2016111210-A1 COMPOSITION FOR FORMING SILICON-CONTAINING FILM AND PATTERN FORMING METHOD USING SAID COMPOSITION JSR株式会社 2016-07-14 WO disclosed
US-9240614-B2 Nonaqueous electrolyte solution and electrochemical element using same UBE INDUSTRIES, LTD. (JP) 2016-01-19 US disclosed
CN-102934275-B Nonaqueous electrolyte solution and electrochemical element using same UBE INDUSTRIES 2015-06-17 CN disclosed
US-8986596-B2 Methods of forming nanoparticles using semiconductor manufacturing infrastructure INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2015-03-24 US disclosed
CN-102656111-B Methods of directed self-assembly with 193nm immersion lithography and layered structures formed therefrom IBM 2015-03-04 CN disclosed
CN-102667623-B Methods of directed self-assembly and layered structures formed therefrom IBM 2014-09-17 CN disclosed
US-8828493-B2 Methods of directed self-assembly and layered structures formed therefrom INTERNATIONAL BUSINESS MACHINES CORPORATION (US) 2014-09-09 US disclosed
CN-102934275-A Nonaqueous electrolyte solution and electrochemical element using same UBE INDUSTRIES 2013-02-13 CN disclosed
CN-102667623-A Methods of directed self-assembly and layered structures formed therefrom IBM 2012-09-12 CN disclosed
CN-102656111-A Methods of directed self-assembly with 193nm immersion lithography and layered structures formed therefrom IBM 2012-09-05 CN disclosed
US-20110147985-A1 METHODS OF DIRECTED SELF-ASSEMBLY AND LAYERED STRUCTURES FORMED THEREFROM INTERNATIONAL BUSINESS MACHINES CORPORATION 2011-06-23 US disclosed
US-20110147983-A1 METHODS OF DIRECTED SELF-ASSEMBLY AND LAYERED STRUCTURES FORMED THEREFROM GLOBALFOUNDRIES U.S. INC. 2011-06-23 US disclosed
US-20110147984-A1 METHODS OF DIRECTED SELF-ASSEMBLY, AND LAYERED STRUCTURES FORMED THEREFROM GLOBALFOUNDRIES U.S. INC. 2011-06-23 US disclosed
CN-1306336-C Photoresist composite and pattern forming process with it SAMSUNG ELECTRONICS CO LTD (KR) 2007-03-21 CN disclosed
CN-1305846-C Urea derivatives SANTEN PHARCEUMATICAL CO LTD (JP) 2007-03-21 CN disclosed
CN-1432871-A Photoresist composite and pattern forming process with it SAMSUNG ELECTRONICS CO LTD (KR) 2003-07-30 CN disclosed