SCHEMBL2003291

SCHEMBL2003291

O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].O=[Si]([O-])[O-].[N-3].[N-3].[N-3].[N-3].[Zr+4].[Zr+4].[Zr+4].[Zr+4].[Zr+4]

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL49558 0.94
SCHEMBL87723 0.94
SCHEMBL6233000 0.88
SCHEMBL4006109 0.88
SCHEMBL1650900 0.88
SCHEMBL409529 0.88
SCHEMBL1367445 0.88
SCHEMBL5668574 0.88
SCHEMBL1395928 0.88
SCHEMBL4130970 0.88

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-7960793-B2 Semiconductor device KABUSHIKI KAISHA TOSHIBA (JP) 2011-06-14 US claimed
US-20090200616-A1 SEMICONDUCTOR DEVICE KABUSHIKI KAISHA TOSHIBA (JP) 2009-08-13 US claimed
US-20080001209-A1 Non-volatile memory device and method of manufacturing the non-volatile memory device SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-01-03 US claimed
CN-112750776-A Method for manufacturing semiconductor device 爱思开海力士有限公司 2021-05-04 CN disclosed
US-9093316-B2 Semiconductor device and method of manufacturing the same SONY CORPORATION (JP) 2015-07-28 US disclosed
US-20140021527-A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME SON JUNG-MIN (KR) 2014-01-23 US disclosed
US-8350344-B2 Semiconductor device and method of fabricating the same SAMSUNG ELECTRONICS CO., LTD. (KR) 2013-01-08 US disclosed
US-20120231620-A1 SEMICONDUCTOR DEVICE AND METHOD OF MANUFACTURING THE SAME SONY CORPORATION (JP) 2012-09-13 US disclosed
US-8203175-B2 Semiconductor device and method of manufacturing the same SONY CORPORATION (JP) 2012-06-19 US disclosed
US-20110220985-A1 SEMICONDUCTOR DEVICE AND METHOD OF FABRICATING THE SAME SON JUNG-MIN 2011-09-15 US disclosed
US-20100181547-A1 Semiconductor device and method of manufacturing the same SONY CORPORATION (JP) 2010-07-22 US disclosed
US-20080001209-A1 Non-volatile memory device and method of manufacturing the non-volatile memory device SAMSUNG ELECTRONICS CO., LTD. (KR) 2008-01-03 US disclosed