SCHEMBL2006386

SCHEMBL2006386

C[Si]1(CCCOCC2CO2)O[Si](C)(CCCOCC2CO2)O[Si](C)(CCCOCC2CO2)O[Si](C)(CCCOCC2CO2)O[Si](C)(CCCOCC2CO2)O1

nearest known ligand 0.61

Predicted protein targets (top 7)

geneUniProtsupporting neighboursconfidence
TSHR P16473 2/20 0.61
SMN1; SMN2 Q16637 1/20 0.58
ALDH1A1 P00352 5/20 0.55
TDP1 Q9NUW8 1/20 0.55
MAPK1 P28482 1/20 0.41
TP53 P04637 1/20 0.30
CYP3A4 P08684 1/20 0.30

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18371651 1.00 TSHR (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL2066081 1.00 TSHR (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL16661604 1.00 TSHR (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL20090069 0.96 TSHR (0.57) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL18371650 0.95 TSHR (0.55) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL16638476 0.93 TSHR (0.53) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL18371657 0.93 SMN1; SMN2 (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL18371655 0.93 SMN1; SMN2 (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL18371653 0.93 SMN1; SMN2 (0.61) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1
SCHEMBL18371656 0.93 TSHR (0.53) TSHRSMN1; SMN2ALDH1A1TDP1MAPK1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 80 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-12024579-B2 Curable liquid composition, particulate filler, and compound TOKYO OHKA KOGYO CO., LTD. (JP) 2024-07-02 US disclosed
US-20230242692-A1 COMPOSITION AND CURED PRODUCT TOKYO OHKA KOGYO CO., LTD. (JP) 2023-08-03 US disclosed
EP-2137576-B1 DUAL PHOTOINITIATOR, PHOTOCURABLE COMPOSITION, USE THEREOF AND PROCESS FOR PRODUCING A THREE DIMENSIONAL ARTICLE 3D SYSTEMS INCORPORATED (US) 2018-08-29 EP disclosed
US-20180113383-A1 COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION TOKYO OHKA KOGYO CO., LTD. (JP) 2018-04-26 US disclosed
US-9856347-B2 Curable composition, cured product thereof, and wafer level lens DAICEL CORPORATION (JP) 2018-01-02 US disclosed
US-20170009003-A1 CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND WAFER LEVEL LENS DAICEL CORPORATION (JP) 2017-01-12 US disclosed
US-20170009003-A1 CURABLE COMPOSITION, CURED PRODUCT THEREOF, AND WAFER LEVEL LENS DAICEL CORPORATION (JP) 2017-01-12 US disclosed
WO-2016013257-A1 POLYCARBOXYLIC ACID, POLYCARBOXYLIC ACID COMPOSITION, EPOXY RESIN COMPOSITION AND HEAT-CURABLE RESIN COMPOSITION EACH CONTAINING SAID POLYCARBOXYLIC ACID, CURED PRODUCTS OF SAID COMPOSITIONS, AND OPTICAL SEMICONDUCTOR DEVICE 日本化薬株式会社 2016-01-28 WO disclosed
WO-2016013642-A1 POLYCARBOXYLIC ACID AND POLYCARBOXYLIC ACID COMPOSITION CONTAINING SAME, EPOXY RESIN COMPOSITION, THERMOSETTING RESIN COMPOSITION, AND CURED MATERIAL OF SAME, AND OPTICAL SEMICONDUCTOR DEVICE 日本化薬株式会社 2016-01-28 WO disclosed
WO-2015056723-A1 CURABLE RESIN COMPOSITION AND CURED PRODUCT THEREOF 日本化薬株式会社 2015-04-23 WO disclosed
EP-0132853-A1 Preimpregnated reinforcements and high strength composites therefrom AMOCO CORPORATION (US) 1985-02-13 EP disclosed
EP-0130270-A1 Epoxy compositions containing oligomeric diamine hardeners and high strength composites therefrom AMOCO CORPORATION (US) 1985-01-09 EP disclosed
EP-0025178-B1 A COMPOSITION CONTAINING A HALF ESTER OF AN ORGANIC POLYOL, AN UNSATURATED MONOMER, AN EPOXIDE, AND REINFORCING FIBER UNION CARBIDE CORPORATION (US) 1984-10-03 EP disclosed
US-4435549-A N-Cyano amide compositions and adducts thereof W. R. GRACE & CO. (US) 1984-03-06 US disclosed
US-4379728-A ADHESIVE, SEALANT OR COATING W. R. GRACE & CO. (US) 1983-04-12 US disclosed
US-4314930-A ACRYLIC ESTER COPOLYMERS; MOLDING MATERIALS UNION CARBIDE CORPORATION (US) 1982-02-09 US disclosed
US-4313859-A M/LDING MATERIALS UNION CARBIDE CORPORATION (US) 1982-02-02 US disclosed
EP-0025527-A1 A composition containing a half ester of an organic polyol, an unsaturated monomer, an epoxide and a basic compound UNION CARBIDE CORPORATION (US) 1981-03-25 EP disclosed
EP-0025178-A1 A composition containing a half ester of an organic polyol, an unsaturated monomer, an epoxide, and reinforcing fiber UNION CARBIDE CORPORATION (US) 1981-03-18 EP disclosed
US-4115295-A EPOXIDE FUNCTIONAL, HYDROXY FUNCTIONAL, DIELECTRICS MINNESOTA MINING AND MANUFACTURING COMPANY (US) 1978-09-19 US disclosed