Predicted protein targets (top 5)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TSHR | P16473 | 2/20 | 0.57 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.55 |
| ▸ | ALDH1A1 | P00352 | 4/20 | 0.51 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.51 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2066081 | 0.96 | TSHR (0.61) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL2006386 | 0.96 | TSHR (0.61) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL18371651 | 0.96 | TSHR (0.61) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL16661604 | 0.96 | TSHR (0.61) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL18371650 | 0.92 | TSHR (0.55) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL18371657 | 0.90 | SMN1; SMN2 (0.61) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL16638476 | 0.90 | TSHR (0.53) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL18371655 | 0.90 | SMN1; SMN2 (0.61) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL18371653 | 0.90 | SMN1; SMN2 (0.61) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 | |
| SCHEMBL18371656 | 0.90 | TSHR (0.53) | TSHRSMN1; SMN2ALDH1A1TDP1MAPK1 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20180113383-A1 | COLORING AGENT DISPERSION, PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, ORGANIC EL ELEMENT, METHOD FOR FORMING PATTERN, AND METHOD FOR PRODUCING PHOTOSENSITIVE RESIN COMPOSITION | TOKYO OHKA KOGYO CO., LTD. (JP) | 2018-04-26 | — | — | US | disclosed |