SCHEMBL20109844

SCHEMBL20109844

C[Si](C)(C)OC(=O)CCOc1ccc(/C=C/C(=O)N2CCCCC2)c(O)c1

nearest known ligand 0.46

Predicted protein targets (top 16)

geneUniProtsupporting neighboursconfidence
PELI1 Q96FA3 3/20 0.46
TRPV1 Q8NER1 1/20 0.42
HPGD P15428 2/20 0.41
SMN1; SMN2 Q16637 1/20 0.41
NPC1 O15118 1/20 0.41
RAB9A P51151 1/20 0.41
PDE3B Q13370 2/20 0.40
PDE3A Q14432 2/20 0.40
P2RY12 Q9H244 2/20 0.40
PDE2A O00408 1/20 0.40
ESR1 P03372 1/20 0.40
ESR2 Q92731 1/20 0.40
MAOB P27338 5/20 0.40
HRH3 Q9Y5N1 1/20 0.39
PTGS2 P35354 1/20 0.39
APP P05067 1/20 0.39

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL766034 0.84 PELI1 (0.52) PELI1TRPV1HPGDMAOBPTGS2
SCHEMBL20109835 0.82 PELI1 (0.54) PELI1TRPV1HPGDSMN1; SMN2NPC1
SCHEMBL20109827 0.81 PELI1 (0.42) PELI1TRPV1HPGDSMN1; SMN2NPC1
SCHEMBL20109834 0.79 PELI1 (0.45) PELI1TRPV1HPGDSMN1; SMN2PDE3B
SCHEMBL20109839 0.78 PELI1 (0.48) PELI1TRPV1HPGDMAOBHRH3
SCHEMBL29449824 0.78 TRPV1 (0.58) PELI1TRPV1HPGDSMN1; SMN2PTGS2
SCHEMBL10230139 0.78 TRPV1 (0.58) PELI1TRPV1HPGDSMN1; SMN2PTGS2
SCHEMBL10321418 0.77 PELI1 (0.49) PELI1TRPV1HPGDSMN1; SMN2NPC1
SCHEMBL10321420 0.77 PELI1 (0.49) PELI1TRPV1HPGDSMN1; SMN2NPC1
SCHEMBL20109846 0.76 PELI1 (0.42) PELI1TRPV1HPGDPDE3BPDE3A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 2 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed
US-20180118887-A1 PRECURSOR COMPOSITION, PHOTOSENSITIVE RESIN COMPOSITION, METHOD FOR PRODUCING PRECURSOR COMPOSITION, CURED FILM, METHOD FOR PRODUCING CURED FILM, AND SEMICONDUCTOR DEVICE FUJIFILM CORPORATION (JP) 2018-05-03 US disclosed