⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL25690504 | 0.82 | — | — | |
| SCHEMBL25987841 | 0.80 | — | — | |
| Ammonia Solution, Strong SCHEMBL3139144 | 0.78 | — | — | |
| SCHEMBL25874055 | 0.78 | — | — | |
| SCHEMBL24521727 | 0.73 | — | — | |
| SCHEMBL23075869 | 0.73 | — | — | |
| SCHEMBL24750222 | 0.73 | — | — | |
| SCHEMBL10066840 | 0.68 | POLB (0.38) | — | |
| SCHEMBL6589600 | 0.67 | — | — | |
| SCHEMBL6590263 | 0.67 | — | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-11773262-B2 | Resin, copper clad laminate made of resin, and printed circuit board | A.C.R. TECH CO., LTD. (TW) | 2023-10-03 | — | — | US | disclosed |
| US-20200263031-A1 | RESIN, COPPER CLAD LAMINATE MADE OF RESIN, AND PRINTED CIRCUIT BOARD | A.C.R. TECH CO., LTD. (TW) | 2020-08-20 | — | — | US | disclosed |
| US-20200040146-A1 | METHOD FOR PREPARING BENZOXAZINE-CONTAINING RESIN COMPOSITION, AND PREPREG AND LAMINATE MADE THEREFROM | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2020-02-06 | — | — | US | disclosed |
| US-20180126701-A1 | HALOGEN-FREE THERMOSETTING RESIN COMPOSITION, PREPREG AND LAMINATE FOR PRINTED CIRCUIT BOARDS USING THE SAME | SHENGYI TECHNOLOGY CO., LTD. (CN) | 2018-05-10 | — | — | US | disclosed |