SCHEMBL20143932

SCHEMBL20143932

CC(C)C1(C)c2ccccc2-c2ccccc21

nearest known ligand 0.43

Predicted protein targets (top 19)

geneUniProtsupporting neighboursconfidence
PDK2 Q15119 5/20 0.39
ATM Q13315 1/20 0.37
THRB P10828 1/20 0.37
TDP1 Q9NUW8 1/20 0.37
MEN1 O00255 2/20 0.35
KMT2A Q03164 2/20 0.35
KDM4E B2RXH2 2/20 0.35
S100A4 P26447 1/20 0.35
LMNA P02545 1/20 0.35
MAPT P10636 1/20 0.35
OPRK1 P41145 1/20 0.35
SMN1; SMN2 Q16637 1/20 0.35
ITGA4 P13612 1/20 0.33
RAB9A P51151 1/20 0.33
CDC25B P30305 1/20 0.33
ESR1 P03372 1/20 0.33
ESR2 Q92731 1/20 0.33
ALDH1A1 P00352 1/20 0.33
PGR P06401 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL18906930 0.81 PDK2 (0.40) PDK2ATMTHRBTDP1KDM4E
SCHEMBL28349427 0.81 PDK2 (0.34) PDK2ATMCDC25B
SCHEMBL24757959 0.78 PDK2 (0.38) PDK2ATM
SCHEMBL26604189 0.78 PDK2 (0.33) PDK2ATM
SCHEMBL24757960 0.78 PDK2 (0.38) PDK2ATM
SCHEMBL22870182 0.78 ATM (0.37) PDK2ATMTHRBTDP1MEN1
SCHEMBL28199301 0.77 PDK2 (0.40) PDK2ATMTHRBTDP1MEN1
SCHEMBL14770886 0.76 PDK2 (0.47) PDK2TDP1MEN1KMT2ALMNA
SCHEMBL20143949 0.76 HTR2A (0.55)
SCHEMBL23315086 0.75 CYP2D6 (0.35) PDK2THRBTDP1MEN1KMT2A

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20230194989-A1 ETHYNYL DERIVED COMPOSITE, A COMPOSITION COMPRISING THEREOF, A METHOD FOR MANUFACTURING A COATING BY IT, AND A METHOD FOR MANUFACTURING A DEVICE COMPRISING THE COATING MERCK PATENT GMBH (DE) 2023-06-22 US disclosed
US-10312074-B2 Method of producing layer structure, layer structure, and method of forming patterns SAMSUNG SDI CO., LTD. (KR) 2019-06-04 US disclosed
US-9971243-B2 Polymer, organic layer composition, organic layer, and method of forming patterns SAMSUNG SDI CO., LTD. (KR) 2018-05-15 US disclosed