SCHEMBL20148900

SCHEMBL20148900

C=C/C(C)=C\C=C(C=C)\C(C=C)=C\C=C(\C)C=C

nearest known ligand 0.37

Predicted protein targets (top 3)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.37
TP53 P04637 1/20 0.37
TSHR P16473 1/20 0.37

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL19818380 1.00 ALDH1A1 (0.37) ALDH1A1TP53TSHR
SCHEMBL19302846 0.87
SCHEMBL18431012 0.87 ALDH1A1 (0.47) ALDH1A1TP53TSHR
SCHEMBL6430277 0.87 ALDH1A1 (0.47) ALDH1A1TP53TSHR
SCHEMBL22757304 0.86 ALDH1A1 (0.32) ALDH1A1TP53TSHR
SCHEMBL19413891 0.83 ALDH1A1 (0.42) ALDH1A1
SCHEMBL15120294 0.82 ALDH1A1 (0.39) ALDH1A1
SCHEMBL18862022 0.80
SCHEMBL22808117 0.80
SCHEMBL19455164 0.78

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 12 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-11840600-B2 Cured epoxy resin material, epoxy resin composition, molded article, and composite material RESONAC CORPORATION (JP) 2023-12-12 US disclosed
US-11795293-B2 Epoxy resin, epoxy resin composition, resin sheet, B-stage sheet, C-stage sheet, cured product, metal foil with resin, metal substrate, and power semiconductor device RESONAC CORPORATION (JP) 2023-10-24 US disclosed
US-11789185-B2 Reflective sheet FUJIFILM CORPORATION (JP) 2023-10-17 US disclosed
US-11220583-B2 Block copolymer, ion-exchange membrane and method of preparing block copolymer KOREA INSTITUTE OF ENERGY RESEARCH (KR) 2022-01-11 US disclosed
US-20210130537-A1 EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT, AND COMPOSITE MATERIAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2021-05-06 US disclosed
US-20210054133-A1 CURED EPOXY RESIN MATERIAL, EPOXY RESIN COMPOSITION, MOLDED ARTICLE, AND COMPOSITE MATERIAL HITACHI CHEMICAL COMPANY, LTD. (JP) 2021-02-25 US disclosed
US-20210016546-A1 EPOXY RESIN, EPOXY RESIN COMPOSITION, RESIN SHEET, B-STAGE SHEET, C-STAGE SHEET, CURED PRODUCT, METAL FOIL WITH RESIN, METAL SUBSTRATE, AND POWER SEMICONDUCTOR DEVICE RESONAC CORPORATION (JP) 2021-01-21 US disclosed
EP-2657315-B1 ORGANIC LIGHT-EMITTING DEVICE LG CHEMICAL LTD (KR) 2020-12-16 EP disclosed
US-20200385512-A1 EPOXY RESIN, EPOXY RESIN COMPOSITION, EPOXY RESIN CURED PRODUCT AND METHOD OF PRODUCING EPOXY RESIN CURED PRODUCT, COMPOSITE MATERIAL, INSULATING MEMBER, ELECTRONIC APPLIANCE, STRUCTURAL MATERIAL, AND VEHICLE RESONAC CORPORATION (JP) 2020-12-10 US disclosed
US-20200299475-A1 BLOCK COPOLYMER, ION-EXCHANGE MEMBRANE AND METHOD OF PREPARING BLOCK COPOLYMER KOREA INSTITUTE OF ENERGY RESEARCH (KR) 2020-09-24 US disclosed
US-10717835-B2 Block copolymer, ion-exchange membrane and method of preparing block copolymer KOREA INSTITUTE OF ENERGY RESEARCH (KR) 2020-07-21 US disclosed
US-20180134844-A1 Block Copolymer, Ion-Exchange Membrane And Method Of Preparing Block Copolymer KOREA INSTITUTE OF ENERGY RESEARCH (KR) 2018-05-17 US disclosed