SCHEMBL20183938

SCHEMBL20183938

C=CCOC(=O)C1(C(=O)OCC=C)CCCCCC1

nearest known ligand 0.36

Predicted protein targets (top 11)

geneUniProtsupporting neighboursconfidence
ALDH1A1 P00352 2/20 0.36
GAA P10253 1/20 0.36
CYP3A4 P08684 1/20 0.36
MAPT P10636 2/20 0.34
TSHR P16473 2/20 0.34
CACNA1B Q00975 1/20 0.34
APBA1 Q02410 1/20 0.34
NPC1 O15118 1/20 0.32
RAB9A P51151 1/20 0.32
HSD17B10 Q99714 1/20 0.32
TDP1 Q9NUW8 1/20 0.32

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL427161 1.00 ALDH1A1 (0.36) ALDH1A1GAACYP3A4MAPTTSHR
SCHEMBL20695813 0.98 CYP3A4 (0.37) ALDH1A1GAACYP3A4MAPTTSHR
SCHEMBL20183946 0.94 CYP3A4 (0.37) ALDH1A1GAACYP3A4MAPTTSHR
SCHEMBL634158 0.91 ALDH1A1 (0.34) ALDH1A1GAACYP3A4MAPTTSHR
SCHEMBL9017819 0.90 CYP3A4 (0.39) ALDH1A1GAACYP3A4MAPTTSHR
SCHEMBL7146425 0.87 MAPT (0.39) ALDH1A1GAACYP3A4MAPTTSHR
SCHEMBL10954517 0.87 TSHR (0.35) ALDH1A1GAACYP3A4MAPTTSHR
SCHEMBL29352689 0.86 ALDH1A1 (0.32) ALDH1A1GAA
SCHEMBL17593100 0.85 CYP3A4 (0.34) ALDH1A1GAACYP3A4MAPTTSHR
SCHEMBL17386422 0.84 ALDH1A1 (0.36) ALDH1A1GAACYP3A4MAPTTSHR

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 11 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-3572464-B1 COMPOSITION FOR LAMINATE OSAKA SODA CO LTD (JP) 2025-06-04 EP disclosed
CN-110023406-B Composition for laminate 株式会社大阪曹达 2022-09-09 CN disclosed
EP-3450503-B1 COMPOSITION FOR LAMINATES OSAKA SODA CO LTD (JP) 2022-03-30 EP disclosed
CN-109071936-B Composition for laminate 株式会社大阪曹达 2022-01-25 CN disclosed
US-20210070909-A1 THERMOSETTING RESIN COMPOSITION OSAKA SODA CO., LTD. (JP) 2021-03-11 US disclosed
EP-3778680-A1 THERMOSETTING RESIN COMPOSITION Osaka Soda Co., Ltd. (JP) 2021-02-17 EP disclosed
CN-111868123-A Thermosetting resin composition 株式会社大阪曹达 2020-10-30 CN disclosed
US-20200040157-A1 NANOSUBSTANCE-CONTAINING COMPOSITION OSAKA SODA CO LTD (JP) 2020-02-06 US disclosed
US-20190136042-A1 COMPOSITION FOR LAMINATES OSAKA SODA CO.,LTD. (JP) 2019-05-09 US disclosed
US-20180186064-A1 COMPOSITION FOR LINING OSAKA SODA CO., LTD. (JP) 2018-07-05 US disclosed
EP-3326784-A1 COMPOSITION FOR LINING Osaka Soda Co., Ltd. (JP) 2018-05-30 EP disclosed