Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | TAS1R3 | Q7RTX0 | 1/20 | 0.42 |
| ▸ | TAS1R1 | Q7RTX1 | 1/20 | 0.42 |
| ▸ | TAS1R2 | Q8TE23 | 1/20 | 0.42 |
| ▸ | GAA | P10253 | 2/20 | 0.39 |
| ▸ | CYP1A2 | P05177 | 1/20 | 0.39 |
| ▸ | CYP2C9 | P11712 | 1/20 | 0.39 |
| ▸ | PKM | P14618 | 1/20 | 0.39 |
| ▸ | CYP2C19 | P33261 | 1/20 | 0.39 |
| ▸ | KDM4E | B2RXH2 | 3/20 | 0.37 |
| ▸ | ALDH1A1 | P00352 | 2/20 | 0.37 |
| ▸ | TDP1 | Q9NUW8 | 2/20 | 0.37 |
| ▸ | AR | P10275 | 2/20 | 0.36 |
| ▸ | NR1H4 | Q96RI1 | 1/20 | 0.36 |
| ▸ | KMT2A | Q03164 | 2/20 | 0.36 |
| ▸ | MEN1 | O00255 | 1/20 | 0.36 |
| ▸ | HTT | P42858 | 1/20 | 0.36 |
| ▸ | SMN1; SMN2 | Q16637 | 1/20 | 0.36 |
| ▸ | POLB | P06746 | 2/20 | 0.36 |
| ▸ | HPGD | P15428 | 2/20 | 0.35 |
| ▸ | ESR1 | P03372 | 1/20 | 0.34 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL2706032 | 0.84 | KDM4E (0.36) | TAS1R3TAS1R1TAS1R2GAAKDM4E | |
| SCHEMBL7110472 | 0.81 | KDM4E (0.37) | GAAKDM4EALDH1A1TDP1AR | |
| SCHEMBL59814 | 0.79 | AR (0.39) | GAAKDM4EALDH1A1TDP1AR | |
| SCHEMBL5181952 | 0.79 | POLB (0.47) | TAS1R3TAS1R1TAS1R2GAACYP1A2 | |
| SCHEMBL19458708 | 0.78 | KDM4E (0.50) | GAACYP1A2CYP2C9PKMCYP2C19 | |
| Propane SCHEMBL9476269 | 0.76 | AR (0.39) | GAAKDM4EALDH1A1TDP1AR | |
| SCHEMBL6904850 | 0.76 | AR (0.36) | GAAKDM4EALDH1A1TDP1AR | |
| SCHEMBL5922597 | 0.76 | AR (0.36) | GAAKDM4EALDH1A1TDP1AR | |
| SCHEMBL20433023 | 0.76 | AR (0.34) | KDM4EALDH1A1TDP1ARHTT | |
| SCHEMBL10941555 | 0.75 | MAPT (0.43) | TAS1R3TAS1R1TAS1R2GAACYP1A2 |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 18 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-20250154361-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND RECESS FILLING METHOD | RESONAC CORPORATION (JP) | 2025-05-15 | — | — | US | disclosed |
| WO-2025047419-A1 | TRANSFER FILM, METHOD FOR MANUFACTURING LAMINATE, AND METHOD FOR MANUFACTURING CIRCUIT WIRING BOARD | 富士フイルム株式会社 | 2025-03-06 | — | — | WO | disclosed |
| WO-2024090516-A1 | RADICAL POLYMERIZABLE RESIN CURING AGENT COMPOSITION AND RADICAL POLYMERIZABLE RESIN COMPOSITION | 株式会社レゾナック | 2024-05-02 | — | — | WO | disclosed |
| EP-4328206-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT OF SAME, AND RECESS FILLING METHOD | Resonac Corporation (JP) | 2024-02-28 | — | — | EP | disclosed |
| WO-2023210777-A1 | TRANSFER FILM, METHOD FOR PRODUCING LAMINATE, METHOD FOR PRODUCING CIRCUIT WIRING SUBSTRATE, CIRCUIT WIRING SUBSTRATE, AND SEMICONDUCTOR PACKAGE | 富士フイルム株式会社 | 2023-11-02 | — | — | WO | disclosed |
| WO-2022224989-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT THEREOF, AND METHOD FOR FILLING RECESS | 昭和電工株式会社 | 2022-10-27 | — | — | WO | disclosed |
| WO-2022224988-A1 | RECESS FILLING MATERIAL KIT, CURED PRODUCT OF SAME, AND RECESS FILLING METHOD | 昭和電工株式会社 | 2022-10-27 | — | — | WO | disclosed |
| EP-3533809-B1 | RADICAL-POLYMERIZABLE RESIN COMPOSITION | SHOWA DENKO KK (JP) | 2021-09-29 | — | — | EP | disclosed |
| EP-3533809-A1 | RADICAL-POLYMERIZABLE RESIN COMPOSITION | Showa Denko K.K. (JP) | 2019-09-04 | — | — | EP | disclosed |
| EP-3228637-B1 | RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF | SHOWA DENKO KK (JP) | 2019-02-20 | — | — | EP | disclosed |
| US-9969836-B2 | Radical-polymerizable resin composition, curing method thereof, method of producing same, use of radical-polymerizable resin composition, and use method of thereof | SHOWA DENKO K.K. (JP) | 2018-05-15 | — | — | US | disclosed |
| US-20180009926-A1 | RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF | SHOWA DENKO K.K. (JP) | 2018-01-11 | — | — | US | disclosed |
| EP-3228637-A1 | RADICAL-POLYMERIZABLE RESIN COMPOSITION, CURING METHOD THEREOF, METHOD OF PRODUCING SAME, USE OF RADICAL-POLYMERIZABLE RESIN COMPOSITION, AND USE METHOD OF THEREOF | Showa Denko K.K. (JP) | 2017-10-11 | — | — | EP | disclosed |
| US-8592130-B2 | Photosensitive resin composition, photosensitive element, method of forming resist pattern and method of producing printed wiring board | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2013-11-26 | — | — | US | disclosed |
| US-20110159430-A1 | PHOTOSENSITIVE RESIN COMPOSITION, PHOTOSENSITIVE ELEMENT, METHOD OF FORMING RESIST PATTERN AND METHOD OF PRODUCING PRINTED WIRING BOARD | HITACHI CHEMICAL COMPANY, LTD. (JP) | 2011-06-30 | — | — | US | disclosed |
| EP-1346717-B1 | One-bottle dental bonding composition | DENTSPLY SANKIN K K (JP) | 2007-05-23 | — | — | EP | disclosed |
| US-20040054028-A1 | Light-curable dental adhesive composition | HATTORI NOBUYUKI (JP) | 2004-03-18 | — | — | US | disclosed |
| EP-1346717-A1 | One-bottle dental bonding composition | DENTSPLY-SANKIN K.K. (JP) | 2003-09-24 | — | — | EP | disclosed |