Known targets — ChEMBL curated mechanism
ADORA1ADORA2AADORA2BADORA3PDE3APDE3BPDE4APDE4BPDE4CPDE4D
The experimentally established mechanism targets of Ethylenediamine. The predicted profile below is derived independently by chemical similarity — agreement is a validation signal, a miss is honest.
Predicted protein targets (top 8)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | MEN1 | O00255 | 1/20 | 0.46 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 1/20 | 0.35 |
| ▸ | CA5A | P35218 | 1/20 | 0.33 |
| ▸ | CA5B | Q9Y2D0 | 1/20 | 0.33 |
| ▸ | LOXL2 | Q9Y4K0 | 1/20 | 0.32 |
| ▸ | ALDH1A1 | P00352 | 1/20 | 0.30 |
| ▸ | TDP1 | Q9NUW8 | 1/20 | 0.30 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| Ethylenediamine SCHEMBL9645942 | 0.96 | MEN1 (0.50) | MEN1KMT2ATSHRCA5ACA5B | |
| Ethylenediamine SCHEMBL8580116 | 0.92 | — | — | |
| Ethylenediamine SCHEMBL11236232 | 0.92 | — | — | |
| Ethylenediamine SCHEMBL6286613 | 0.92 | MEN1 (0.46) | MEN1KMT2ATSHRCA5ACA5B | |
| Ethylenediamine SCHEMBL11443647 | 0.92 | MEN1 (0.46) | MEN1KMT2ATSHRCA5ACA5B | |
| Ethylenediamine SCHEMBL8214212 | 0.92 | MEN1 (0.46) | MEN1KMT2ATSHRCA5ACA5B | |
| Ethylenediamine SCHEMBL3746450 | 0.92 | MEN1 (0.46) | MEN1KMT2ATSHRCA5ACA5B | |
| Ethylenediamine SCHEMBL3613718 | 0.92 | MEN1 (0.46) | MEN1KMT2ATSHRCA5ACA5B | |
| Ethylenediamine SCHEMBL3746452 | 0.92 | MEN1 (0.46) | MEN1KMT2ATSHRCA5ACA5B | |
| Ethylenediamine SCHEMBL11039278 | 0.92 | MEN1 (0.46) | MEN1KMT2ATSHRCA5ACA5B |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 25 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-10462908-B2 | Conductive patterns and methods of using them | ALPHA ASSEMBLY SOLUTIONS INC. (US) | 2019-10-29 | — | — | US | disclosed |
| EP-2064000-B1 | SOLVENT SYSTEMS FOR METALS AND INKS | ALPHA ASSEMBLY SOLUTIONS INC (US) | 2018-01-17 | — | — | EP | disclosed |
| US-20170164484-A1 | Conductive Patterns and Methods of Using Them | CITIBANK, N.A. | 2017-06-08 | — | — | US | disclosed |
| US-9615463-B2 | Method for producing a high-aspect ratio conductive pattern on a substrate | CITIBANK, N.A. | 2017-04-04 | — | — | US | disclosed |
| EP-2174324-B1 | METHOD OF MANUFACTURING PRINTED CIRCUIT BOARD | ALPHA METALS (US) | 2017-01-11 | — | — | EP | disclosed |
| US-9217088-B2 | Particles and inks and films using them | ALPHA METALS, INC. (US) | 2015-12-22 | — | — | US | disclosed |
| US-20140186524-A1 | SOLVENT SYSTEMS FOR METALS AND INKS | ALPHA METALS, INC. (US) | 2014-07-03 | — | — | US | disclosed |
| EP-2380688-B1 | Particles and Inks and Films Using Them | ALPHA METALS (US) | 2014-06-04 | — | — | EP | disclosed |
| US-8597548-B2 | Solvent systems for metals and inks | ALPHA METALS, INC. (US) | 2013-12-03 | — | — | US | disclosed |
| EP-2066470-B1 | METHODS OF PREPARING SILVER PARTICLES, SILVER PARTICLE INKS AND SILVER PARTICLE FILMS | FRY METALS INC (US) | 2013-10-09 | — | — | EP | disclosed |
| EP-2064000-A2 | SOLVENT SYSTEMS FOR METALS AND INKS | Fry's Metals, Inc. (US) | 2009-06-03 | — | — | EP | disclosed |
| WO-2009020464-A9 | CONDUCTIVE PATTERNS AND METHODS OF USING THEM | FRY METALS INC (US) | 2009-04-30 | — | — | WO | disclosed |
| WO-2009020464-A1 | CONDUCTIVE PATTERNS AND METHODS OF USING THEM | FRY'S METALS, INC. (US) | 2009-02-12 | — | — | WO | disclosed |
| US-20080145560-A1 | Used with capped metal (silver) particles to provide a dispersion that may be used to print conductive lines | CITIBANK, N.A. | 2008-06-19 | — | — | US | disclosed |
| US-20080137316-A1 | CONDUCTIVE PATTERNS AND METHODS OF USING THEM | CITIBANK, N.A. | 2008-06-12 | — | — | US | disclosed |
| WO-2008036752-A2 | SOLVENT SYSTEMS FOR METALS AND INKS | FRY'S METALS, INC. (US) | 2008-03-27 | — | — | WO | disclosed |
| WO-2008017062-A1 | PARTICLES AND INKS AND FILMS USING THEM | FRY'S METALS, INC. (US) | 2008-02-07 | — | — | WO | disclosed |
| US-20080032047-A1 | PARTICLES AND INKS AND FILMS USING THEM | CITIBANK, N.A. | 2008-02-07 | — | — | US | disclosed |
| US-4242438-A | FOR INIGRATED CIRCUITS; TRANSPARENT, POROUS ALUMINUM OXIDE LAYER CONTAINING SILVER HALIDES IN THE PORES | FUJI PHOTO FILM CO., LTD. (JP) | 1980-12-30 | — | — | US | disclosed |
| US-4059445-A | SILVER HALIDE EMULSION PHOTOGRAPHY | FUJI PHOTO FILM CO., LTD. (JA) | 1977-11-22 | — | — | US | disclosed |