SCHEMBL202396

SCHEMBL202396

CC(=O)C1=C(C)NC(C)=C(C(C)=O)C1c1ccc([N+](=O)[O-])cc1[N+](=O)[O-]

nearest known ligand 0.51

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
KMT2A Q03164 4/20 0.51
MEN1 O00255 3/20 0.51
CACNA1C Q13936 6/20 0.51
CACNA1F O60840 4/20 0.51
CACNA1D Q01668 4/20 0.51
CACNA1S Q13698 4/20 0.51
HIF1A Q16665 4/20 0.51
ALDH1A1 P00352 3/20 0.51
CYP1A2 P05177 3/20 0.51
CYP3A4 P08684 3/20 0.51
MAPT P10636 3/20 0.51
CYP2C9 P11712 3/20 0.51
CYP2C19 P33261 3/20 0.51
ADORA3 P0DMS8 2/20 0.51
SMN1; SMN2 Q16637 2/20 0.51
LMNA P02545 2/20 0.51
CYP2D6 P10635 2/20 0.51
TSHR P16473 2/20 0.51
NFKB1 P19838 2/20 0.51
MAPK1 P28482 2/20 0.51

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29395113 1.00 KMT2A (0.51) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL9400597 0.89 KMT2A (0.51) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL30533378 0.86 ADORA3 (0.71) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL3029836 0.86 ADORA3 (0.71) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL202183 0.82 CACNA1C (0.73) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL29358809 0.82 CACNA1C (0.73) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL29004553 0.78 CACNA1C (0.57) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL3037209 0.77 KMT2A (0.50) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL9138577 0.77 CACNA1C (0.67) KMT2AMEN1CACNA1CCACNA1FCACNA1D
SCHEMBL8440987 0.76 MEN1 (0.57) KMT2AMEN1HIF1AALDH1A1CYP3A4

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 94 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
EP-0578177-B1 Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern NITTO DENKO CORP (JP) 1997-03-05 EP claimed
EP-0578177-A2 Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern NITTO DENKO CORPORATION (JP) 1994-01-12 EP claimed
US-12479960-B2 Triazine ring-containing polymer and film forming composition containing same NISSAN CHEMICAL CORPORATION (JP) 2025-11-25 US disclosed
WO-2025013746-A1 PATTERN-FORMING COMPOSITION 日産化学株式会社 2025-01-16 WO disclosed
CN-117597398-A Composition for pattern formation 日产化学株式会社 2024-02-23 CN disclosed
CN-117321141-A Solvent-free composition 日产化学株式会社 2023-12-29 CN disclosed
CN-117279999-A Composition for forming film 日产化学株式会社 2023-12-22 CN disclosed
CN-117279979-A Triazine ring-containing polymer and film-forming composition containing same 日产化学株式会社 2023-12-22 CN disclosed
CN-117279980-A Triazine ring-containing polymer and composition for pattern formation 日产化学株式会社 2023-12-22 CN disclosed
CN-117279998-A Solvent-free composition 日产化学株式会社 2023-12-22 CN disclosed
CN-117255822-A Triazine ring-containing polymer and composition for pattern formation 日产化学株式会社 2023-12-19 CN disclosed
US-7320854-B2 Mixture of oxide particles, polymerizable compound,radiation sensitive decomposer and releasing agent JSR CORPORATION (JP) 2008-01-22 US disclosed
US-20060229384-A1 Polymer precursor, high transparency polyimide precursor, polymer compound, resin composition and article using thereof DAI NIPPON PRINTING CO., LTD. (JP) 2006-10-12 US disclosed
EP-1494072-A2 Radiation sensitive refractive index changing composition, pattern forming method and optical material JSR Corporation (JP) 2005-01-05 EP disclosed
US-20040265737-A1 Radiation sensitive refractive index changing composition, pattern forming method and optical material JSR CORPORATION (JP) 2004-12-30 US disclosed
US-6333139-B1 PROVIDING POLYIMIDE PRECURSOR SOLUTION COMPRISING A POLYIMIDE PRECURSOR AND PHOTOSENSITIVE AGENT ON A LONG STAINLESS STEEL FOIL; FURTHER PROVIDING CONDUCTOR LAYER FORMED BY LAMINATING COPPER LAYER VIA CHROMIUM LAYER OR TITANIUM LAYER OR DIRECTLY NITTO DENKO CORPORATION (JP) 2001-12-25 US disclosed
US-6117616-A Circuit-forming substrate and circuit substrate NITTO DENKO CORPORATION (JP) 2000-09-12 US disclosed
US-5851736-A Heat-resistant photoresist composition, photosensitive substrate, and process for forming heat-resistant positive or negative pattern NITTO DENKO CORPORATION (JP) 1998-12-22 US disclosed
EP-0578177-B1 Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern NITTO DENKO CORP (JP) 1997-03-05 EP disclosed
EP-0578177-A2 Heat-resistant negative photoresist composition, photosensitive substrate, and process for forming negative pattern NITTO DENKO CORPORATION (JP) 1994-01-12 EP disclosed