Predicted protein targets (top 20)
| gene | UniProt | supporting neighbours | confidence | |
|---|---|---|---|---|
| ▸ | ALDH1A1 | P00352 | 6/20 | 0.59 |
| ▸ | CYP3A4 | P08684 | 3/20 | 0.59 |
| ▸ | TP53 | P04637 | 1/20 | 0.53 |
| ▸ | MAOB | P27338 | 2/20 | 0.52 |
| ▸ | CASP1 | P29466 | 1/20 | 0.46 |
| ▸ | RECQL | P46063 | 1/20 | 0.46 |
| ▸ | TSHR | P16473 | 2/20 | 0.46 |
| ▸ | MAPT | P10636 | 2/20 | 0.46 |
| ▸ | POLB | P06746 | 1/20 | 0.46 |
| ▸ | HSP90AA1 | P07900 | 1/20 | 0.46 |
| ▸ | APP | P05067 | 1/20 | 0.41 |
| ▸ | SMN1; SMN2 | Q16637 | 2/20 | 0.39 |
| ▸ | MEN1 | O00255 | 1/20 | 0.39 |
| ▸ | MITF | O75030 | 1/20 | 0.39 |
| ▸ | GAA | P10253 | 1/20 | 0.39 |
| ▸ | GFER | P55789 | 1/20 | 0.39 |
| ▸ | KMT2A | Q03164 | 1/20 | 0.39 |
| ▸ | NLRP1 | Q9C000 | 1/20 | 0.39 |
| ▸ | NOD2 | Q9HC29 | 1/20 | 0.39 |
| ▸ | MAPK1 | P28482 | 1/20 | 0.39 |
Click a target to see other patent compounds predicted against it — the reverse direction, in place.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL29436308 | 1.00 | ALDH1A1 (0.59) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL1805630 | 0.87 | ALDH1A1 (0.59) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL12024590 | 0.83 | ALDH1A1 (0.55) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL15458085 | 0.80 | CYP3A4 (0.56) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL15457963 | 0.80 | CYP3A4 (0.56) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL2229241 | 0.79 | ALDH1A1 (0.50) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL29366090 | 0.78 | CYP3A4 (0.54) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL1523 | 0.78 | CYP3A4 (0.54) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL15271467 | 0.77 | CYP3A4 (0.48) | ALDH1A1CYP3A4TP53MAOBCASP1 | |
| SCHEMBL2668319 | 0.77 | PPARA (0.54) | ALDH1A1CYP3A4TP53MAOBTSHR |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 52 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-12077644-B2 | Amide acid oligomer process for molding polyimide composites | KANEKA AMERICAS HOLDING, INC. (US) | 2024-09-03 | — | — | US | claimed |
| US-20210340344-A1 | Novel Amide Acid Oligomer Process For Molding Polyimide Composites | KANEKA AMERICAS HOLDING, INC. (US) | 2021-11-04 | — | — | US | claimed |
| EP-3841152-A1 | A NOVEL AMIDE ACID OLIGOMER PROCESS FOR MOLDING POLYIMIDE COMPOSITES | Kaneka Americas Holding, Inc. (US) | 2021-06-30 | — | — | EP | claimed |
| US-10815390-B2 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | KANEKA CORPORATION (JP) | 2020-10-27 | — | — | US | claimed |
| WO-2020072639-A1 | A NOVEL AMIDE ACID OLIGOMER PROCESS FOR MOLDING POLYIMIDE COMPOSITES | KANEKA AMERICAS HOLDING, INC. (US) | 2020-04-09 | — | — | WO | claimed |
| US-20180273798-A1 | POLYIMIDE RESIN COMPOSITION AND VARNISH PRODUCED FROM TERMINAL-MODIFIED IMIDE OLIGOMER PREPARED USING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER AND THERMOPLASTIC AROMATIC POLYIMIDE PREPARED USING OXYDIPHTHALIC ACID, POLYIMIDE RESIN COMPOSITION MOLDED ARTICLE AND PREPREG HAVING EXCELLENT HEAT RESISTANCE AND MECHANICAL CHARACTERISTIC, AND FIBER-REINFORCED COMPOSITE MATERIAL THEREOF | KANEKA CORPORATION (JP) | 2018-09-27 | — | — | US | claimed |
| US-10017666-B2 | Polyimide resin composition and varnish produced from terminal-modified imide oligomer prepared using 2-phenyl-4,4′-diaminodiphenyl ether and thermoplastic aromatic polyimide prepared using oxydiphthalic acid, polyimide resin composition molded article and prepreg having excellent heat resistance and mechanical characteristic, and fiber-reinforced composite material thereof | KANEKA CORPORATION (JP) | 2018-07-10 | — | — | US | claimed |
| US-12077644-B2 | Amide acid oligomer process for molding polyimide composites | KANEKA AMERICAS HOLDING, INC. (US) | 2024-09-03 | — | — | US | disclosed |
| US-12049545-B2 | Uncured laminate, reinforcing fiber composite material, method for producing uncured laminate, and method for producing reinforcing fiber composite material | KANEKA CORPORATION (JP) | 2024-07-30 | — | — | US | disclosed |
| CN-117062716-A | Laminate body | 琳得科株式会社 | 2023-11-14 | — | — | CN | disclosed |
| EP-3144338-B1 | VARNISH INCLUDING 2-PHENYL-4,4'-DIAMINODIPHENYL ETHER, IMIDE RESIN COMPOSITION HAVING EXCELLENT MOLDABILITY, CURED RESIN MOLDED ARTICLE HAVING EXCELLENT BREAKING ELONGATION, PREPREG THEREOF, IMIDE PREPREG THEREOF, AND FIBER-REINFORCED MATERIAL THEREOF HAVING HIGH HEAT RESISTANCE AND EXCELLENT MECHANICAL STRENGTH | KANEKA CORP (JP) | 2023-10-25 | — | — | EP | disclosed |
| CN-116890497-A | Laminate, transparent conductive film, and method for producing transparent conductive film | 琳得科株式会社 | 2023-10-17 | — | — | CN | disclosed |
| CN-113226746-B | Gas barrier laminate | 琳得科株式会社 | 2023-08-11 | — | — | CN | disclosed |
| EP-0710684-A2 | Preparation process of polyhydroxycarboxylic acid | MITSUI TOATSU CHEMICALS, Inc. (JP) | 1996-05-08 | — | — | EP | disclosed |
| US-5147943-A | Thermosetting resin; polyimide containing a modifying monoamine alcohol | UBE INDUSTRIES, LTD. (JP) | 1992-09-15 | — | — | US | disclosed |
| US-4963645-A | UNSATURATED END GROUPS | UBE INDUSTRIES, LTD. (JP) | 1990-10-16 | — | — | US | disclosed |
| EP-0379131-A2 | Thermosetting resin composition | UBE INDUSTRIES, LTD. (JP) | 1990-07-25 | — | — | EP | disclosed |
| EP-0371154-A1 | Prepreg of reinforced imide oligomer | UBE INDUSTRIES, LTD. (JP) | 1990-06-06 | — | — | EP | disclosed |
| US-4921745-A | Honeycomb structure of aromatic polyimide | UBE INDUSTRIES, LTD. (JP) | 1990-05-01 | — | — | US | disclosed |
| EP-0304913-A2 | Terminal-modified imide oligomer and solution composition of the same | UBE INDUSTRIES, LTD. (JP) | 1989-03-01 | — | — | EP | disclosed |