⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.
Similar compounds — the chemically nearest patent molecules
Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.
| Compound | similarity | top predicted | shared targets | |
|---|---|---|---|---|
| SCHEMBL6736479 | 0.67 | — | — | |
| SCHEMBL28309360 | 0.66 | — | — | |
| SCHEMBL1826779 | 0.63 | — | — | |
| SCHEMBL3849367 | 0.63 | TDP1 (0.36) | — | |
| SCHEMBL7576401 | 0.61 | — | — | |
| SCHEMBL5969450 | 0.61 | TDP1 (0.35) | — | |
| SCHEMBL8693788 | 0.60 | — | — | |
| SCHEMBL5727910 | 0.60 | — | — | |
| SCHEMBL7759966 | 0.60 | — | — | |
| SCHEMBL22190073 | 0.59 | TDP1 (0.32) | — |
Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.
Patent provenance — the patents this molecule appears in, and who filed them
Claimed or disclosed in 14 patents. claimed = in the patent's claims; disclosed = body only.
| Patent | Title | Assignee | Published | Priority | Filing | Country | Status |
|---|---|---|---|---|---|---|---|
| US-8696974-B2 | Adhesive composition, process for producing the same, molded objects, and process for producing heat-shrinkable tube | SUMITOMO ELECTRIC FINE POLYMER, INC. (JP) | 2014-04-15 | — | — | US | claimed |
| US-20100320650-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, MOLDED OBJECTS, AND PROCESS FOR PRODUCING HEAT-SHRINKABLE TUBE | SUMITOMO ELECTRIC FINE POLYMER, INC (JP) | 2010-12-23 | — | — | US | claimed |
| US-20070020413-A1 | Adhesive composition, process for producing the same, molded objects, and process for producing heat-shrinkable tube | SUMITOMO ELECTRIC FINE POLYMER, INC. (JP) | 2007-01-25 | — | — | US | claimed |
| EP-1650281-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, MOLDED OBJECTS, AND PROCESS FOR PRODUCING HEAT-SHRINKABLE TUBE | Sumitomo Electric Fine Polymer, Inc. (JP) | 2006-04-26 | — | — | EP | claimed |
| EP-2886339-B1 | RESIN SHEET, SUPPORT BODY WITH RESIN LAYER, LAMINATE PLATE, AND METAL-CLAD LAMINATE PLATE | MITSUBISHI GAS CHEMICAL CO (JP) | 2017-03-01 | — | — | EP | disclosed |
| US-20150210832-A1 | RESIN SHEET, SUPPORT WITH RESIN LAYER, LAMINATE AND METAL FOIL-CLAD LAMINATE | MITSUBISHI GAS CHEMICAL COMPANY, INC. (JP) | 2015-07-30 | — | — | US | disclosed |
| EP-2886339-A1 | RESIN SHEET, SUPPORT BODY WITH RESIN LAYER, LAMINATE PLATE, AND METAL-CLAD LAMINATE PLATE | Mitsubishi Gas Chemical Company, Inc. (JP) | 2015-06-24 | — | — | EP | disclosed |
| EP-2327751-B1 | Process for producing a heat shrinkable tube | SUMITOMO ELEC FINE POLYMER INC (JP) | 2014-06-11 | — | — | EP | disclosed |
| US-8696974-B2 | Adhesive composition, process for producing the same, molded objects, and process for producing heat-shrinkable tube | SUMITOMO ELECTRIC FINE POLYMER, INC. (JP) | 2014-04-15 | — | — | US | disclosed |
| EP-2327751-A1 | Process for producing a heat shrinkable tube | Sumitomo Electric Fine Polymer, Inc. (JP) | 2011-06-01 | — | — | EP | disclosed |
| US-20100320650-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, MOLDED OBJECTS, AND PROCESS FOR PRODUCING HEAT-SHRINKABLE TUBE | SUMITOMO ELECTRIC FINE POLYMER, INC (JP) | 2010-12-23 | — | — | US | disclosed |
| US-20070020413-A1 | Adhesive composition, process for producing the same, molded objects, and process for producing heat-shrinkable tube | SUMITOMO ELECTRIC FINE POLYMER, INC. (JP) | 2007-01-25 | — | — | US | disclosed |
| EP-1650281-A1 | ADHESIVE COMPOSITION, PROCESS FOR PRODUCING THE SAME, MOLDED OBJECTS, AND PROCESS FOR PRODUCING HEAT-SHRINKABLE TUBE | Sumitomo Electric Fine Polymer, Inc. (JP) | 2006-04-26 | — | — | EP | disclosed |
| US-20030168158-A1 | Method of film laminating | ZEON CORPORATION (JP) | 2003-09-11 | — | — | US | disclosed |