SCHEMBL203057

SCHEMBL203057

CC(C)(c1ccc(Oc2cccc(N)c2)cc1)c1cccc(C(C)(C)c2ccc(Oc3cccc(N)c3)cc2)c1

nearest known ligand 0.65

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
▸ MAOB P27338 1/20 0.58
▸ ALDH1A1 P00352 5/20 0.50
▸ MAPT P10636 4/20 0.50
▸ SMN1; SMN2 Q16637 2/20 0.50
▸ MEN1 O00255 2/20 0.50
▸ KMT2A Q03164 2/20 0.50
▸ MITF O75030 1/20 0.50
▸ GAA P10253 1/20 0.50
▸ GFER P55789 1/20 0.50
▸ NLRP1 Q9C000 1/20 0.50
▸ NOD2 Q9HC29 1/20 0.50
▸ NPC1 O15118 3/20 0.47
▸ RAB9A P51151 3/20 0.47
▸ HPGD P15428 1/20 0.47
▸ MAPK1 P28482 1/20 0.47
▸ ESR1 P03372 1/20 0.47
▸ ESR2 Q92731 1/20 0.47
▸ CYP3A4 P08684 2/20 0.46
▸ ATM Q13315 1/20 0.44
▸ POLB P06746 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL29492478 1.00 MAOB (0.58) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL30853973 0.95 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29492480 0.95 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL202158 0.95 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL29374472 0.95 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL125626 0.95 MAOB (0.63) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL3647253 0.94 MAOB (0.68) MAOBALDH1A1MAPTSMN1; SMN2MEN1
Benzene SCHEMBL9083189 0.93 MAOB (0.67) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL3465746 0.92 ALDH1A1 (0.61) MAOBALDH1A1MAPTSMN1; SMN2MEN1
SCHEMBL14012483 0.91 ALDH1A1 (0.56) MAOBALDH1A1MAPTSMN1; SMN2MEN1

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 140 patents — showing the first 20. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-5525704-A AROMATIC THERMOSETTING RESIN COMPRISING AROMATIC DIAMINE AND BISMALEIMIDE MONOMERS; FLEXIBILITY, WORKABILITY AND MOLDABILITY MITSUI TOATSU CHEMICALS, INC. (JP) 1996-06-11 — — US claimed
US-5364967-A Addition-type polyimides, flexibility, solubility MITSUI TOATSU CHEMICALS, INC. (JP) 1994-11-15 — — US claimed
EP-0425265-B1 Aromatic diamine compounds, bismaleimide compounds, thermosetting resins forming compositions therefrom, resins therefrom, and methods for their preparation MITSUI TOATSU CHEMICALS (JP) 1994-08-03 — — EP claimed
EP-0425265-A1 Aromatic diamine compounds, bismaleimide compounds, thermosetting resins forming compositions therefrom, resins therefrom, and methods for their preparation MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-05-02 — — EP claimed
US-20240199878-A1 RESIN COMPOSITION, FORMED ARTICLE AND FILM KANEKA CORPORATION (JP) 2024-06-20 — — US disclosed
WO-2023249079-A1 RESIN COMPOSITION, MOLDED BODY, AND FILM 株式会社カネカ 2023-12-28 — — WO disclosed
WO-2023195525-A1 FILM, METHOD FOR MANUFACTURING SAME, AND IMAGE DISPLAY DEVICE 株式会社カネカ 2023-10-12 — — WO disclosed
WO-2023149435-A1 RESIN COMPOSITION, MOLDED OBJECT, AND FILM 株式会社カネカ 2023-08-10 — — WO disclosed
WO-2023100806-A1 FILM, PRODUCTION METHOD THEREFOR, AND IMAGE DISPLAY DEVICE 株式会社カネカ 2023-06-08 — — WO disclosed
EP-2980058-B1 COMPOSITION CONTAINING VINYL-GROUP-CONTAINING COMPOUND TOKYO OHKA KOGYO CO LTD (JP) 2023-05-03 — — EP disclosed
US-20230101181-A1 CURABLE PHOTOSENSITIVE RESIN COMPOSITION, CURED PRODUCT, RESIST PATTERN, METHOD OF PRODUCING RESIST PATTERN, SEMICONDUCTOR DEVICE AND ELECTRONIC DEVICE ARAKAWA CHEMICAL INDUSTRIES, LTD. (JP) 2023-03-30 — — US disclosed
US-11566108-B2 Polyimide film, laminate and surface material for display DAI NIPPON PRINTING CO., LTD. (JP) 2023-01-31 — — US disclosed
US-5354839-A Low dielectric constant, colorless, transparent and excellent in processability and heat resistance MITSUI TOATSU CHEMICALS, INCORPORATED (JP) 1994-10-11 — — US disclosed
EP-0451404-B1 Thermosetting resin forming compositions and process for preparing the same MITSUI TOATSU CHEMICALS (JP) 1994-09-21 — — EP disclosed
EP-0425265-B1 Aromatic diamine compounds, bismaleimide compounds, thermosetting resins forming compositions therefrom, resins therefrom, and methods for their preparation MITSUI TOATSU CHEMICALS (JP) 1994-08-03 — — EP disclosed
EP-0572196-A1 Polyimide, and preparation process of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-12-01 — — EP disclosed
EP-0565352-A2 Aromatic diamine and polyimde, and preparation process of same MITSUI TOATSU CHEMICALS, Inc. (JP) 1993-10-13 — — EP disclosed
US-5206438-A AROMATIC DIAMINE COMPOUNDS, BISMALEIMIDE COMPOUNDS, THERMOSETTING RESIN FORMING COMPOSITIONS THEREFROM, RESINS THEREFROM, AND METHODS FOR THEIR PREPARATION MITSUI TOATSU CHEMICALS, INC. (JP) 1993-04-27 — — US disclosed
US-5106937-A Storage stability, mechanical strength, molding materials; reacting with aromatic diamines MITSUI TOATSU CHEMICALS, INC. (JP) 1992-04-21 — — US disclosed
EP-0425265-A1 Aromatic diamine compounds, bismaleimide compounds, thermosetting resins forming compositions therefrom, resins therefrom, and methods for their preparation MITSUI TOATSU CHEMICALS, Inc. (JP) 1991-05-02 — — EP disclosed
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