SCHEMBL20312457

SCHEMBL20312457

CC1(C)COB(c2cnccn2)OC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20312377 0.79 HSP90AA1 (0.34) —
SCHEMBL1534997 0.76 LPL (0.32) —
SCHEMBL20312450 0.76 HSP90AA1 (0.32) —
SCHEMBL29740147 0.76 LPL (0.32) —
SCHEMBL29749739 0.75 SLC6A2 (0.33) —
SCHEMBL20312468 0.75 SLC6A2 (0.33) —
SCHEMBL20312464 0.74 HSP90AA1 (0.31) —
SCHEMBL4078174 0.71 MAPT (0.36) —
SCHEMBL20312455 0.69 SNCA (0.33) —
SCHEMBL20312385 0.69 HSP90AA1 (0.36) —

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 3 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-10504732-B2 Impurity diffusion agent composition and method for manufacturing semiconductor substrate TOKYO OHKA KOGYO CO, LTD. (JP) 2019-12-10 — — US disclosed
US-20180182624-A1 IMPURITY DIFFUSION AGENT COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2018-06-28 — — US disclosed
US-20180182624-A1 IMPURITY DIFFUSION AGENT COMPOSITION AND METHOD FOR MANUFACTURING SEMICONDUCTOR SUBSTRATE TOKYO OHKA KOGYO CO., LTD. (JP) 2018-06-28 — — US disclosed
Send feedback