SCHEMBL20348441

SCHEMBL20348441

CC(=O)c1cc(C(=O)O)ccc1OC=O

nearest known ligand 0.49

Predicted protein targets (top 20)

geneUniProtsupporting neighboursconfidence
TSHR P16473 3/20 0.49
RAB9A P51151 2/20 0.49
KDM4E B2RXH2 1/20 0.49
ALDH1A1 P00352 1/20 0.49
GAA P10253 1/20 0.49
CA12 O43570 1/20 0.47
CA1 P00915 1/20 0.47
CA2 P00918 1/20 0.47
CA4 P22748 1/20 0.47
CA6 P23280 1/20 0.47
CA7 P43166 1/20 0.47
TPMT P51580 1/20 0.47
CA9 Q16790 1/20 0.47
CA14 Q9ULX7 1/20 0.47
AKR1C3 P42330 6/20 0.44
AKR1C2 P52895 6/20 0.44
CREBBP Q92793 2/20 0.44
HTT P42858 2/20 0.44
LMNA P02545 1/20 0.44
MAPK1 P28482 1/20 0.44

Click a target to see other patent compounds predicted against it — the reverse direction, in place.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL20348440 0.87 TSHR (0.49) TSHRRAB9AKDM4EALDH1A1GAA
SCHEMBL6636593 0.81 CA12 (0.67) TSHRRAB9AKDM4EALDH1A1GAA
SCHEMBL11563743 0.79 KDM4E (0.71) TSHRRAB9AKDM4EALDH1A1GAA
SCHEMBL10020264 0.79 TSHR (0.51) TSHRRAB9AKDM4EALDH1A1GAA
SCHEMBL28826353 0.79 CA12 (0.76) TSHRRAB9AKDM4EALDH1A1GAA
SCHEMBL28118006 0.79 KMT2A (0.50) TSHRRAB9AKDM4EALDH1A1GAA
SCHEMBL5874015 0.78 KMT2A (0.53) TSHRRAB9AKDM4EALDH1A1GAA
SCHEMBL16098877 0.78 CA12 (0.73) TSHRRAB9AKDM4EALDH1A1GAA
SCHEMBL14904503 0.77 TSHR (0.42) TSHRKDM4EALDH1A1HTTMAPK1
SCHEMBL28067566 0.77 TTR (0.57) TSHRRAB9AKDM4EALDH1A1GAA

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 1 patent. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-20180187028-A1 WATER-DISPERSED ELECTRODEPOSITION SOLUTION FOR FORMING INSULATING FILM MITSUBISHI MATERIALS CORPORATION (JP) 2018-07-05 US disclosed