SCHEMBL2038552

SCHEMBL2038552

CCC[Si]1(CCC)CCCCCC1

nearest known ligand 0.00

⚠ Novel chemotype — no close known analogue (best Tanimoto < 0.3). Unexplored chemical space relative to ChEMBL.

Similar compounds — the chemically nearest patent molecules

Nearest neighbours by Morgan-fingerprint cosine across the patent-compound collection, with each neighbour's top predicted target and the predicted targets it shares with this molecule.

Compoundsimilaritytop predictedshared targets
SCHEMBL2037026 1.00
SCHEMBL2029122 0.97
SCHEMBL2037917 0.90
SCHEMBL19484838 0.88
SCHEMBL19484836 0.85
SCHEMBL15636683 0.83
SCHEMBL2034165 0.82 CYP1A2 (0.33)
SCHEMBL2034199 0.82 CYP1A2 (0.33)
SCHEMBL2035694 0.80 TSHR (0.35)
SCHEMBL2031734 0.80 TSHR (0.35)

Similarity is cosine over the 2,048-bit Morgan fingerprint (≈ Tanimoto). Identical fingerprints score 1.00.

Patent provenance — the patents this molecule appears in, and who filed them

Claimed or disclosed in 4 patents. claimed = in the patent's claims; disclosed = body only.

PatentTitleAssigneePublishedPriorityFilingCountryStatus
US-8497391-B2 Insulating film material, method of film formation using insulating film material, and insulating film NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) 2013-07-30 US disclosed
CN-102906865-A Low dielectric constant interlayer insulating film and method for forming low dielectric constant interlayer insulating film TAIYO NIPPON SANSO CORP 2013-01-30 CN disclosed
US-20120328798-A1 INTER-LOW-PERMITTIVITY LAYER INSULATING FILM, AND METHOD FOR FORMING INTER-LOW-PERMITTIVITY LAYER INSULATING FILM TRI CHEMICAL LABORATORIES INC. (JP) 2012-12-27 US disclosed
US-20110130584-A1 INSULATING FILM MATERIAL, METHOD OF FILM FORMATION USING INSULATING FILM MATERIAL, AND INSULATING FILM NATIONAL INSTITUTE FOR MATERIALS SCIENCE (JP) 2011-06-02 US disclosed